Operation
OM-SC7610
SC7610 Sputter Coater
22
Issue 1
6
Operation
The
SC7610 Sputter Coater
is designed to be durable and has a long lifetime. The Instrument
does contain items, primarily the Target that has finite lifetimes, in order to sustain optimum
performance it will need replacing periodically. The lifespan of the Target is dependant on a number
of factors, including operating in good vacuum levels, contamination and the purity of the gas being
used. The Target should be replaced when it starts to become perforated.
6.1
Test Procedure
CAUTION
Contamination can seriously affect the sputtering process
To reduce the possibility of contamination by airborne particles, minimise the
time the vacuum chamber is open to the atmosphere.
This test procedure, which checks the system is operating correctly, should be performed at the
following times:
After the installation process has been completed.
After any operation that could lead to contamination of the vacuum chamber.
(a)
Preparation
(i)
Check that
LEAK
and
VENT
valves are closed, (fully clockwise).
(ii)
Check the argon cylinder regulator is open. Set pressure to 0.7 bar (5-10psi).
(iii)
Set
TIME
control to 15 seconds.
(iv)
Check that mains power is available, set the rear panel mounted
POWER ON/OFF
switch to the down position. (ON).
(b)
Set vacuum pressure
.
(i)
Operate
START PUMP
switch, the integeral indicator will illuminate and the rotary
pump will start.
(ii)
After 10-15 seconds (dependant on the size of rotary pump), the vacuum gauge will
register a fall in pressure within the chamber. Continue pumping until the chamber
pressure reaches 3 x 10
-2
mbar or better, (indicating there are no major leaks in the
system).
(iii)
Open the
LEAK
valve (turn knob counter-clockwise, three to four turns) until the
vacuum chamber pressure increases to approximately 6 x 10
-2
mbar.
(c)
Set process current
Whilst continuing to adjust the
LEAK
valve, intermittently operate the
SET PLASMA
button,
the
PROCESS CURRENT
meter will register the current flow and sputtering will occur. Open
or close the
LEAK
valve to adjust the current to 18mA. Release the
SET PLASMA
button.
(d)
Adjust discharge current
(i)
Operate the
START PROCESS
button, the sputtering process will commence. The
current will rise to about 18 mA and a blue or purple discharge glow will be visible,
gold-palladium (or other target material) will be sputtered onto the base plate. After 15
seconds, the timer will terminate the process, the discharge will cease and the
indicator extinguish.
(ii)
Whilst the sputtering process is in progress, outgassing of the system can alter the
process current. Use the
LEAK
valve to correct these changes.