MPC555 / MPC556
ELECTRICAL CHARACTERISTICS
MOTOROLA
USER’S MANUAL
Rev. 15 October 2000
G-2
Functional operating conditions are given in
G.7 DC Electrical Characteristics
. Ab-
solute maximum ratings are stress ratings only, and functional operation at the maxi-
mum is not guaranteed. Stress beyond those listed may affect device reliability or
cause permanent damage to the device.
This device contains circuitry protecting against damage due to high static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid appli-
cation of any voltages higher than maximum-rated voltages to this high-impedance cir-
cuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate
logic voltage level (e.g., either V
SS
or V
DD
).
G.2 Target Failure Rate
Target failure rate of
TBD
ppm pending characterization and evaluation of qualifiable
silicon.
G.3 Package
The MPC555 / MPC556 is available in two forms, packaged and die. The package is
a 272-ball PBGA, Motorola case outline 1135A-01 (See
of the MPC555 Us-
er’s Manual for a case drawing or contact Motorola.) For die characteristics, contact
the Motorola factory.
G.4 EMI Characteristics
G.4.1 Reference Documents
The documents referenced for the EMC testing of MPC555 / MPC556 are listed below.
1. SAE J1752/3 Issued 1995-03
2. VDE UK 767.14/ZVEI-Ad-Hoc-HL-AK Version1.0 May 1994
G.4.2 Definitions and Acronyms
EMC — Electromagnetic compatibility
EMI — Electromagnetic interference
TEM cell — Transverse electromagnetic mode cell
3. During program/erase operation the value of V
PP
must be 5.0 V
±
5%.
4. V
DDA
= 5.0 V
±
10%.
5. All 3-V input pins are 5-V tolerant. This applies to all input pins.
6. Refers to allowed random sequencing of power supplies.
7. Maximum continuous current on I/O pins provided the overall power dissipation is below the power dissipation
of the package. Proper operation is not guaranteed at this condition.
8. Condition applies to one pin at a time.
9. Transitions within the limit do not affect device reliability or cause permanent damage. Exceeding limit may cause
permanent conversion error on stressed channels and on unstressed channels.
10. Solder profile per CDF-AEC-Q100, current revision.
11. Moisture sensitivity per JEDEC test method A112.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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