Mitsubishi GX Configurator-PT, Руководство пользователя

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MELSEC-Q
5 SETUP AND PROCEDURES BEFORE OPERATION
!
CAUTION
Never disassemble or modify the module.
Failure to observe this could lead to trouble, malfunctioning, injuries or fires.
Always turn all phases of the power supply OFF externally before installing or removing the
module.
Failure to turn all phases OFF could lead to module trouble or malfunctioning.
Use the PLC within the general specifications environment given in this manual.
Using the PLC outside the general specification range environment could lead to electric
shocks, fires, malfunctioning, product damage or deterioration.
Hold down the module mounting lever at the bottom of the module and securely insert the
module fixing projection into the fixing holes of the base module. Improper mounting of the
module may lead to malfunctioning, faults, or dropping.
When using the module in the environment subject to much vibration, secure the module with a
screw.
Tighten the screw within the range of the specified tightening torque.
Insufficient tightening may lead to dropping, short-circuit, or malfunctioning.
Excessive tightening may damage the screw or module, leading to dropping, short-circuit, or
malfunctioning.
(1) Main body
•
The main body case is made of plastic. Take care not to drop or apply strong
impacts onto the case.
•
Do not remove the QD70 PCB from the case. Failure to observe this could lead
to faults.
(2) Cable
•
Do not press on the cable with a sharp object.
•
Do not twist the cable with force.
•
Do not forcibly pull on the cable.
•
Do not step on the cable.
•
Do not place objects on the cable.
•
Do not damage the cable sheath.
(3) Installation environment
Do not install the module in the following type of environment.
•
Where the ambient temperature exceeds the 0 to 55
°
C range.
•
Where the ambient humidity exceeds the 5 to 95%RH range.
•
Where there is sudden temperature changes, or where dew condenses.
•
Where there is corrosive gas or flammable gas.
•
Where there are high levels of dust, conductive powder, such as iron chips, oil
mist, salt or organic solvents.
•
Where the module will be subject to direct sunlight.
•
Where there are strong electric fields or magnetic fields.
•
Where vibration or impact could be directly applied onto the main body.
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