Appendix G: Using a Cascade Microtech PA200 Prober
Model 4200A-SCS Parameter Analyzer Reference Manual
G-16
4200A-901-01 Rev. C / February 2017
Aligning the wafer
1. Enter Point 1 and Point 2 distances from the center using specific X die size multiples. See the
following figure. In other words, if the die size is: X = 13.573 mm, and Y = 14.818 mm, set up to
move four die to the left and also the right at 54.292 mm (4 • 13.573 mm = 54.292 mm).
Figure 653: Aligning the wafer Step a
2. Select
Automatically move chuck to each point
.
3. Select
Automatically turn on chuck vacuum
.
4. Click
Begin
.
Start the Alignment Wizard
1. Move to Point 1 (left of center die align pad and pins).
2. Click
Continue
to start the Alignment Wizard.
3. Manually align pins and pads (POINT 1).
4. Click
Continue
(from POINT 1) and move 8 die (for this example) to the right.
