Advantech EKI-9312P Series, Руководство пользователя

Страница: 10 / 286

Electrostatic Discharge Requirements
Follow the steps below to protect components from electrostatic discharge:
1. Wear an ESD wrist strap when installing the device.
2. Handle the power adapter by its edge and do not touch any component or printed
circuit boards.
Temperature/Humidity Requirements
Make sure to keep the temperature and humidity of the installation location at an optimal
level. Very high temperatures may cause poor insulation, power leakage, mechanical
property changes, and metal component corrosion. Very high temperatures will also
accelerate insulation aging, which will greatly degrade reliability and even severely shorten
operation life.
Under over-low humidity environments, insulation spacers may shrink, resulting in
loosening of mounting screws. Extremely low humidity may also cause static electricity,
which will damage the circuit.
Maintenance Requirements
Dust is a major safety hazard for this device. Dust may cause electrostatic absorption,
resulting in bad contact between metal connectors or metal joints. Electrostatic absorption
is faster and easier in environments with very low humidity, shortening device life and also
causing communication failure.
Dust content and particle size requirements are as follows:
Table 1. Dust Content and Particle Size Requirements
Mechanical Active Substance
Content (number/m
³
)
Dust Particle
≤3×104 (no dust can be seen on desk in three days)
Dust particle
diameter: ≥5μm
Aside from dust, there should be strict limitation on air contained in the room where the
device is located. Too much salt, acid and sulfide in the air will accelerate metal corrosion
and aging process of certain components. There should measures to prevent harmful gas
such as SO
2
, H
2
S, NH
3
and CI
2
from entering the operational environment.
Table 2. Maximum Values for Harmful Gases
Gas
Max. Value (mg/m
³
)
SO
2
0.2
H
2
S 0.0006
NH
3
0.05
Cl
2
0.01
ix