SEF 551.10, Operating Manual

Page: 35 / 238

Page 4.3
4.0 Technical data
Technical Data 551_15 \ 04.2015 \
Depth: 785 mm
Width: 2006 mm
Height: 554 mm
Depth opened: 1050 mm
Depth opened (with option lamp pole) : 1170 mm
Height opened ( without base cabinet ) : approx. 1000 mm
Weight ( without base cabinet ) : 175 kg
Colour: RAL 9010 pure white
RAL 3001 signal red
Safety class IP 20
Continuous sound pressure level: 60dB(A)
Electric connection: 230/400VAC 50/60Hz
16A CEECON
allowed tolerance mains voltage +6% / -10%
Max. heatup power: approx. 11 kW
Nominal power: approx. 5-6 kW
(Lead free soldering process)
(power consumption depends on the
soldering profile, PCB size and
assembled components)
Power consumption in
standby mode (100°C):
2100 W
(at 20°C ambient temperature)
Ambient temperature
during operation:
5° up to 40°C
Ambient temperature
during transport
and storage
(DIN EN 60204-1, 4.5)
: -25° up to 55°C
Maximum allowed air humidity 50% +40°C
(DIN EN 60204-1, 4.4.4):
90% +20°C / no condensation
PCB/component sizes:
Minimum size: 15 x 10 mm
Working width mesh belt: 440 mm
Useable working width mesh belt: 405 mm
Working width pin chain (optional): 35-400 mm
Maximum assembly height: 45 mm (incl. fixture)
Maximum reflow temperature:
280 °C
Conveyor speed: 15 - 90 cm/min
Active chamber length 551.10: 850 mm
Active chamber length 551.15: 1050 mm
PCB cooling 551.10: 2 blowers
-
cooling module zone 5
PCB cooling 551.15: 3 fans -
fan-module in the outlet
Medium process time: 5-8 min
(depending on soldering profile)
Exhaustions: approx. 270 m
3
/h
(emmisions within the exhaust air depend
on the used solder paste or chip adhesive)
Exhaust connection piece: Connection Ø 60 mm
(at rear side)
Emissions
Dimensions
Electrical connec-
tion values
Allowed
component sizes
Characteristics
Allowed climatic
demands
Soldering system 551.10 / 551.15