phyCORE-OMAP44xx
Part I: PCM-049/phyCORE-OMAP44xx System on Module
L-760e_1 © PHYTEC Messtechnik GmbH 2012
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1.16 Hints for Integrating and Handling the phyCORE-OMAP44xx
1.16.1 Integrating the phyCORE-OMAP44xx
Successful integration in user target circuitry greatly depends on the adherence to the layout design rules for
the GND connections of the phyCORE module. As a general design rule we recommend connecting all GND pins
neighboring signals which are being used in the application circuitry. Just for the power supply of the module
at least 10 GND pins corresponding to the VCC pins must be connected (refer to
EMI performance all GND pins should be connected to a solid ground plane.
Besides this hardware manual much information is available to facilitate the integration of the phyCORE-
OMAP44xx into customer applications.
•
the design of the standard phyCORE Carrier Board can be used as a reference for any customer application.
•
many answers to common questions can be found at http://www.phytec.de/de/support/faq/faq-
phyCORE-
OMAP44xx
.html, or http://www.phytec.eu/europe/support/faq/faq-
phyCORE-OMAP44xx
.html.
•
the link "Carrier Board" within the category Dimensional Drawing leads to the layout data as shown in
. It is available in different file formats.
•
different support packages are available to support you in all stages of your embedded development.
Please visit http://www.phytec.de/de/support/support-pakete.html, or http://www.phytec.eu/europe/
support/support-packages.html, or contact our sales team for more details.
1.16.2 Handling the phyCORE-OMAP44xx
Removal of various components, such as the microcontroller and the standard quartz, is not advisable given the
compact nature of the module. Should this nonetheless be necessary, please ensure that the board as well as
surrounding components and sockets remain undamaged while de-soldering. Overheating the board can cause
the solder pads to loosen, rendering the module inoperable. Carefully heat neighboring connections in pairs.
After a few alternations, components can be removed with the solder-iron tip. Alternatively, a hot air gun can
be used to heat and loosen the bonds.
Caution:
If any modifications to the module are performed, regardless of their nature, the manufacturer guarantee is
voided.