Wirnet iBTS
Document title : Installation and
Maintenance Manual
Version : 2.0
Author : SNI
Date : 04/12/2018
Classification
This document is the strict property of Kerlink and shall not be either copied nor sent without express
written authorization of Kerlink
Internal Use
Kerlink m2m technologies reserved rights
Confidential
Kerlink – 1 rue Jacqueline Auriol – 35235 THORIGNÉ-FOUILLARD
Page 50 / 221
Strict confidential
1.5.3.3
Dual WAN module characteristics
The Dual WAN module supports the following features:
Feature
Description
2x Mini PCI Express
Interfaces
USB only (no PCI Express interface available)
Full Mini Card form factor (F1, F2)
Only one frequency bands dependent version is available
Both WAN 4G Mini PCI board may be active in parallel, i.e. attached to
the network at the same time.
Backup battery
5 x 25F/2.7V supercapacitors
15 minutes charging time
Up to one minute capacity to ensure safe power down of the Wirnet
iBTS
Operating
temperature range
-20°C to +85°C
Current drain @48V /
PCI express interface
21mA HSPA Rx (attached)
72mA HSPA Tx@Pout max
1.5.3.4
Supported Mini PCIe cards
The Dual WAN module embeds two Mini PCI express boards.
So far, only one Mini PCIe board / LTE modem dedicated for Europe and APAC is available:
MC7304 from Sierra Wireless. This MiniPCIe card is described in chapter 1.5.2.3.1.
If other Mini PCI express boards are required, contact KERLINK.
1.5.4
LoRa module
–
LoRa LOC
1.5.4.1
Mechanical description
1.5.4.1.1
Single “LoRa-LOC” module
The LoRa-LOC module is composed of five main mechanical parts:
A “three-sides” flange including:
o
the connectors and interfaces placement
o
venting of internal boards through many holes
A rear plate with fixing points for screwing on the blind threaded standoffs
Two radiators used as right and left side flanges
A front-end lid, used as a shield for the front-end board
