•
Heatsink and fan
— Air-cooled heatsink assembly
— Red over-temperature warning LED
•
Power
— PCIe input power including required 2x4 auxiliary power connector
— Blue power-good status LED
— On/off slide power switch for benchtop operation
— On-board power and temperature measurement circuitry
•
Mechanical
— PCIe standard height form-factor (full height, ¾ length, dual-width)
— 4.375” x 10.0” board size
— Two slots height with heatsink/fan assembly
•
Operating environment
— Maximum ambient temperature of 0-35°C
1.3. Box Contents
•
Intel Agilex F-Series (Two F-Tiles)FPGA Development Kit
•
1x DDR4 DIMM module
•
1x IO48 HPS daughter board
•
USB 2.0 MicroUSB cable
•
240W power adapter and NA/EU/JP/UK cords
1.4. Recommended Operating Conditions
Table 2.
Recommended Operating Conditions
Operating Condition
Range of Values
Ambient operating temperature range
0°C to 35°C
Maximum ICC load current
150 A
Maximum ICC load transient percentage
30%
FPGA maximum power supported by active heatsink/fan
150 W
When handling the board, it is important to observe static discharge precautions.
Caution:
Without proper anti-static handling, the board can be damaged. Therefore, use anti-
static handling precautions when touching the development kit.
Caution:
This development kit should not be operated in a vibration environment.
1. Overview
739942 | 2022.09.21
Intel
®
Agilex
™
F-Series FPGA (Two F-Tiles) Development Kit User Guide
6
