Attention:
When you handle static-sensitive devices, take precautions to
avoid damage from static electricity. For details about handling these devices,
see “Handling static-sensitive devices” on page 40.
3. Remove the cover (see “Removing the cover” on page 50).
4. Remove the air baffle (see “Removing the air baffle” on page 51).
5. Locate microprocessor socket 2 on the system board (see “System-board
internal connectors” on page 33).
6. Rotate the heat sink retention module release lever to the open position.
7. Open the microprocessor socket release levers and retainer:
a. Identify which release lever is labeled as the first release lever to open and
open it.
b. Open the second release lever on the microprocessor socket.
c. Open the microprocessor retainer.
Attention:
Do not touch the connectors on the microprocessor and the
microprocessor socket.
8. Install the microprocessor on the microprocessor socket:
a. Touch the static-protective package that contains the new microprocessor
to any
unpainted
on the chassis or any
unpainted
metal surface on any
other grounded rack component; then, carefully remove the microprocessor
from the package.
b. Release the sides of the cover and remove the cover from the installation
tool. The microprocessor is preinstalled on the installation tool.
Chapter 2. Installing optional devices
81
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