Emerson E2, Installation And Operation Manual

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E2 RX/BX/CX I&O Manual Table of Contents • v
TABLE OF CONTENTS
1 INTRODUCTION...................................................................................................................................................... 1-1
1.1 T
HE
E2 R
EFRIGERATION
C
ONTROLLER
(RX)............................................................................................................ 1-1
1.2 T
HE
E2 B
UILDING
C
ONTROLLER
(BX)...................................................................................................................... 1-2
1.3 T
HE
E2 C
ONVENIENCE
S
TORE
C
ONTROLLER
(CX)................................................................................................... 1-3
1.4 N
ETWORKING
O
VERVIEW
.......................................................................................................................................... 1-4
1.4.1 E2 I/O Network .................................................................................................................................................. 1-4
1.4.2 The E2 Echelon Lonworks Network................................................................................................................... 1-5
1.4.3 Interconnection With Other E2s ........................................................................................................................ 1-5
1.5 D
OCUMENTATION
O
VERVIEW
................................................................................................................................... 1-6
1.6 O
N
-L
INE
H
ELP
S
YSTEM
O
VERVIEW
.......................................................................................................................... 1-7
1.7 S
OFTWARE
L
ICENSING
............................................................................................................................................... 1-7
2 HARDWARE OVERVIEW...................................................................................................................................... 2-1
2.1 E2 H
ARDWARE
.......................................................................................................................................................... 2-1
2.1.1 E2 Main Processor Board (CPU) ...................................................................................................................... 2-2
2.1.2 E2 Processor Interface Board (PIB).................................................................................................................. 2-2
2.1.3 E2 Keypad .......................................................................................................................................................... 2-2
2.1.4 LEDs................................................................................................................................................................... 2-2
2.2 I/O N
ETWORK
B
OARDS AND
P
ERIPHERALS
............................................................................................................... 2-3
2.2.1 The Gateway Board ........................................................................................................................................... 2-3
2.2.2 MultiFlex Boards ............................................................................................................................................... 2-4
2.2.2.1 MultiFlex 16 Input Board ........................................................................................................................................ 2-4
2.2.2.2 MultiFlex Combination Input/Output Boards.......................................................................................................... 2-4
2.2.2.3 MultiFlex CUB ........................................................................................................................................................ 2-6
2.2.2.4 MultiFlex RTU (BX and CX Only) ......................................................................................................................... 2-6
2.2.2.5 MultiFlex Rooftop Control Board (RCB) (BX and CX Only) ................................................................................ 2-6
2.2.2.6 MultiFlex PAK Board.............................................................................................................................................. 2-6
2.2.3 The MultiFlex ESR Board .................................................................................................................................. 2-7
2.2.4 Hand-held Terminal (P/N 814-3110)................................................................................................................. 2-7
2.2.5 The 8RO and 8ROSMT Relay Boards................................................................................................................ 2-8
2.2.6 4AO Analog Output Board................................................................................................................................. 2-9
2.2.7 8DO Digital Output Board and PMAC II Anti-Sweat Controller ..................................................................... 2-9
2.3 E
CHELON
N
ETWORK
B
OARDS AND
P
ERIPHERALS
................................................................................................... 2-10
2.3.1 The 16AIe (Discontinued) ................................................................................................................................ 2-10
2.3.2 The 8ROe (Discontinued)................................................................................................................................. 2-10
2.3.3 EC-2s................................................................................................................................................................ 2-11
2.3.4 CC-100 Case Controllers and CS-100 Case Circuit Controllers.................................................................... 2-11
2.3.5 TD3 Temperature Display ............................................................................................................................... 2-12
2.3.6 Facility Status Display (FSD) .......................................................................................................................... 2-12
3 MOUNTING............................................................................................................................................................... 3-1
3.1 M
OUNTING THE
E2 .................................................................................................................................................... 3-1
3.1.1 Standard Mount.................................................................................................................................................. 3-1
3.1.2 Recessed Mount.................................................................................................................................................. 3-1
3.1.3 Retrofit Mounting ............................................................................................................................................... 3-2
3.1.4 Blank Face ......................................................................................................................................................... 3-3
3.2 M
OUNTING
I/O B
OARDS
............................................................................................................................................ 3-3
3.2.1 Single/Double Enclosures ................................................................................................................................. 3-3
3.2.2 Boards Without Enclosures (Snap Track).......................................................................................................... 3-4