Pace PROGRAMMABLE THERMOFLO, Руководство по эксплуатации и техническому обслуживанию

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47
OPERATION
12. Lower nozzle (with component) to a point where the component leads/
contacts rest gently on or just above the component land pattern.
NOTE
If component has been previously positioned on land pattern, lower any
Box or Pattern nozzle to a height of 1mm (.040") above the PCB.
NOTE
Any required preheating operating should be completed before advancing
beyond this point.
11. Using the Vacuum Pick Adjust Control, adjust the height of the
component relative to the nozzle as desired. PACE recommends that:
Figure 51.
BGA components are to be positioned fully into the nozzle. The walls
of the V-A-N nozzles will contact the component body.
The bottom of the nozzle should be positioned 1mm (0.040") above the
PCB when using Box or Pattern nozzles.
V-A-N Nozzle
Box Nozzle
Pattern Nozzle