Pace PROGRAMMABLE THERMOFLO, Руководство по эксплуатации и техническому обслуживанию

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35
OPERATION
WARNING
The component is HOT! DO NOT remove or catch the component with
bare hands. Allow the component to drop onto the heat resistant surface.
Allow sufficient time for the component and PCB to cool to room temperature
before handling.
11. For Single Jet nozzles, hold the end of the nozzle tube
above the rework area at a height and angle which
gives the best results in your particular application.
Figure 29.
Handpiece
12. Press and hold the handpiece Cycle Switch to activate heat cycle (the
maximum cycle time is 999 seconds).
13. When complete solder melt is observed, gently lift the handpiece to remove
the component from the PCB. When using a Curved, Single Jet nozzle, use a
vacuum pickup device or tweezers to lift the component from the PCB; steps
14 & 15 are not used.
14. Position the nozzle (with component) over a heat resistant surface.
15. Press and hold the Vacuum Pick Switch for 0.5 second (minimum) to
deactivate vacuum and release component.
Figure 28.