Kurtz Ersa HR 600/2, Перевод оригинального руководства по эксплуатации, Страница: 73 / 169

6 | Function description
The user interface
– [Move axis backward]: It allows moving the heads manually backward. This is
also possible with the key combination [Ctrl] + [Top arrow key].
By pressing the scroll wheel while holding down the mouse button, the move-
ment can be sped up or slowed down. If an overlay is displayed in the display
window, you can move this overlay up.
– [Move axis up]: To manually move the pick-and-place nozzle upwards. For
movement, keep the mouse button pressed.
– [Move axis down]: Allows moving the pick-and-place nozzle manually down-
ward. For movement, keep the mouse button pressed.
– [Rotate counter clockwise]: Rotates the pick-and-place nozzle counterclock-
wise. If an overlay is displayed in the display window, you can rotate this over-
lay counterclockwise.
– [Rotate clockwise]: Rotates the pick-and-place nozzle clockwise. If an overlay is
displayed in the display window, you can rotate this overlay clockwise.
[Parking position]: Moves the heads to the park position.
Keep the travel path of the axles clear!
– [Switch placer vacuum]: Activates or deactivates the vacuum of the pick-and-
place nozzle. When vacuum is active, the button is highlighted.
DANGER
Laser beam! Risk of injury due to retinal burns
a) Do not stare into the laser beam!
b) Do not point the laser beam at other people! Reflecting surfaces under the laser
generate reflections!
c) Class 2 laser according to DIN EN 60825-1:2008-5, P < 1 mW, λ = 650 nm
[Switch laserpointer on/off]: Turns the laser beam on or off. The laser can be used
to manually locate a component.
Undefined
BGA Socket
– Part filter: The camera automatic detection for components on the glass plate
is optimised for the type of component selected here. In this drop-down menu,
you can select a filter and enable it by clicking on the button. A component
filter to be called up in the [Placement] tab can also be set in the profile para-
meters.
[undefined] = all other component types, [BGA] = Ball Grid Array, [QFP] = Quad
Flat Package, [PLCC] = Plastic Leaded Chip Carrier, [MLF] = [Micro Lead Pack-
age], [SOIC] = Small Outline IC, [CSP] = Chip Scale Package, [LED] = Light-emit-
ting diode, [CBGA] = Ceramic Ball Grid Array, [Interposer BGA] = BGA on wiring
layer, [BGA Socket] = Ball Grid Array Socket.
– First status indication: Shows which functions are being currently executed by
the system.
Ersa GmbH 3BA00207_01 Operating Instructions HR 600_2 | Rev. 3 73 / 169