MTi 1-series User Manual
Xsens MTi User Manual Repository
Hardware Integration Manual
Copyright © 2021 Xsens
Page 94
Heat
Keep the MTi 1-series module away from heat sources. Thermal gradients can cause
mechanical stress, which can affect the sensor performance of the MTi 1-series.
Sockets
For best performance, it is best to solder the module directly onto a PCB by a solder reflow
process. When placed in a socket, the module may be subjected to mechanical stress by the
springs in the socket, which might result in deteriorated performance.
Hand soldering
It is not recommended to solder the module by hand onto a PCB, as this may introduce
It is not recommended to solder the module by hand onto a PCB, as this may introduce
undesired (mechanical or thermal) stress on the module,
undesired (mechanical or thermal) stress on the module,
which can result in
which can result in
deteriorated performance
deteriorated performance
.
.
Magnetometer
The MTi 1-series uses a 3D magnetometer for measuring the geomagnetic field. This part is
sensitive to magnetic disturbances.
Ferromagnetic materials
Ferromagnetic materials can be magnetized and the magnetic behaviour can change during
operation. This behaviour will influence the measurements of the 3D magnetometer of the
MTi 1-series. Therefore, keep these ferromagnetic materials away from the MTi 1-series.
High currents
High current power lines on the PCB will introduce magnetic fields that will influence the
measurements of the 3D magnetometer of the MTi 1-series. Place high current power lines
away from the MTi 1-series.
Example: a power line with a current of 100 mA at a distance of 10 mm will introduce an error of
2 µT.
