MTi 1-series User Manual
Xsens MTi User Manual Repository
Hardware Integration Manual
Copyright © 2021 Xsens
Page 90
Design
Design
PCB layout
Frames of reference used in MTi 1-series
Origin of measurements
Mechanical stress
Pushbutton contacts
Anchor points
Vibrations
Heat
Sockets
Hand soldering
Ferromagnetic materials
High currents
Footprint
PCB layout
To prevent current flows that can influence the performance of the MTi 1-series, it is
recommended to remove all copper (planes) underneath the MTi 1-series as shown in the
image below.
Layout example