MTi 1-series User Manual
Xsens MTi User Manual Repository
Datasheet
Copyright © 2021 Xsens
Page 45
Design and Packaging
Design and Packaging
Footprint
Tray packaging information
Tray of 20 pcs (MTi-#-T or MTi-#-0I-T)
Tray of 100 pcs (MTi-#-C or MTi-#-0I-C)
Reel packaging information (MTi-#-R or MTi-#-0I-R)
Package drawing
Footprint
The footprint of the MTi 1-s module is similar to a 28-lead Plastic Leaded Chip Carrier package
(JEDEC MO-047). Although it is recommended to solder the MTi 1-s module directly onto a PCB,
it can also be mounted in a compatible PLCC socket (e.g. 8428-21B1-RK of M3, as used on the
MTi 1-series Development Kit). When using a socket, make sure that it supports the maximum
dimensions of the MTi 1-series module as shown under #Package drawing (note the tolerance
of ± 0.1 mm).
Recommended MTi 1-series module footprint
The MTi 1-s module is shipped in trays with 20 or 100 modules or in reels with 250 modules.
