SUN EAST PEAK-350
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70 -74
Chapter VII Appendix
A. Common Soldering Problems and Solutions
SOLDERING
PROBLEMS
Reasons
SOLUTIONS
Soldering Failures
The wires are oxidized
on the surface of copper
foil.
Clean the oxide.
The proportion of flux
is not right.
Re-mix up the flux as required.
Bad soldering
The PCB should not be stored for a long
period.
Chemical
reaction
between the flux and
copper foil.
Check if the flux is in good condition.
The flux is deteriorated. Replace it.
Soldering insufficiently. Adjust the soldering wave.
The PCB is warped.
Adjust
the
soldering
wave
and
temperature.
Solder Flag
The
flux
oxidized
affects the fluidity.
Check the flux.
The PCB is preheated
insufficiently.
Adjust the preheating temperature.
The proportion of flux
is not right.
Check the flux.
The
soldering
temperature is too low.
Check
and
adjust
the
soldering
temperature.
The speed of conveyor
is too slow.
Adjust its speed.
The PCB is attached too
solder.
Adjust the wave height.
The area and diameter
of copper soil is too
large.
Improve the design of PCB.
The PCB is not good
enough to be soldered.
Avoid keep the PCB for too long time.
Solder
Bridge
The soldering time of
PCB is too short.
Adjust the wave and conveyor speed.
The PCB is preheated
insufficiently.
Adjust the preheating temperature.
The proportion of flux
is not right.
Check the flux.
The design of PCB is
not reasonable.
Improve the design of PCB.
