SUN EAST PEAK-350
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13 -74
LEAD (The content of LEAD in the solder is less than 1000ppm).
lift-off:
It is also called fillet lifting. It is one of soldering failures that the wire is separated from
the PCB.
Bridge:
Two joints are connected with each other.
Short Circuit:
Two joints that may cause short circuit are connected with each other (Note:
BRIDGE will not cause short circuit while SHORT is one of BRIDGES).
Cold solder joint:
The surface of soldering point is not smooth resulting from the wetting is not
enough. Its feature is the surface is gray and has many holes owing to insufficient heat and
mistakenly cleaning.
Solder bump:
There appears solder bumps on the surface of PCB and the solder is round
because the solder is affected by cohesion itself.
Icicle:
The top of soldering point is like the icicle due to insufficient wetting between solder and
wires.
Solder flags:
There appears solder flags resulting from insufficient wetting of wire.
Solderability:
It means the joints
’
(Joints are wire, PCB or thread) ability of wetting (Wetting
means the ability of being soldered) for strong connection.
Poor wetting:
The solder does not cover the joint thoroughly and the joint is exposed in the air.
SMT:
It is the abbreviation of Surface Mounted Technology, which is one of popular technology
and techniques in electronic assembly industry.
SMC
:
It is the abbreviation of Surface Mounted Components, which consists of rectangular
components, columnar components, compound components, and heteromorphy components.
SMD
:
It is the abbreviation of Surface Mounted Devices, which consists of slice-type transistor
and integrate circuit and the integrate circuit consists of SOP, SOJ, PLCC, LCCC, QFP, BGA,
CSP, FC, MCM and so on.
VOC:
It is the abbreviation of Volatile Organic Compound. VOC can be worked as the carrier of
active element in fluxes, which can destroy the ozonosphere, so the fluxes without VOC are
commonly used.
temperature profile:
It can show the changes of temperature during the whole soldering process.
2.2 Machine Dimension:
Machine Dimension (L
×
W
×
H)
3600mm(L)
×
1400mm(W)
×
1500mm(H)
(Refer to Figure 1.1)
Total Power
34KW
