EN 6
3139 785 31532
2.
Safety Information, General Notes & Lead Free Requirements
2.3
Lead Free Requirement
Information about Lead-free produced sets
Philips CE is starting production of lead-free sets from
1.1.2005
onwards.
INDENTIFICATION:
Regardless of special logo (not always indicated)
One must treat all sets from
1 Jan 2005
onwards, according
next
rules.
Example S/N:
Bottom line of typeplate gives a 14-digit S/N. Digit 5&6 is the year, digit 7&8 is
the week number, so in this case 1991 wk 18
So from 0501 onwards = from 1 Jan 2005 onwards
Important note: In fact also products of year 2004 must be treated in this way as long as you
avoid mixing solder-alloys (leaded/ lead-free). So best to always use SAC305 and the higher
temperatures belong to this.
Due to lead-free technology some rules have to be respected by the
workshop during a repair:
•
Use only lead-free solder alloy Philips SAC305 with order
code 0622 149 00106. If lead-free solder-pate is required,
please contact the manufacturer of your solder-equipment.
In general use of solder-paste within workshops should be
avoided because paste is not easy to store and to handle.
•
Use only adequate solder tools applicable for lead-free
solder alloy. The solder tool must be able
o To reach at least a solder-temperature of 400°C,
o To stabilize the adjusted temperature at the solder-tip
o To exchange solder-tips for different applications.
•
Adjust your solder tool so that a temperature around 360°C
– 380°C is reached and stabilized at the solder joint.
Heating-time of the solder-joint should not exceed ~ 4 sec.
Avoid temperatures above 400°C otherwise wear-out of
tips will rise drastically and
fl
ux-
fl
uid will be destroyed. To
avoid wear-out of tips switch off un-used equipment, or
reduce heat.
•
Mix of lead-free solder alloy / parts with leaded solder alloy
/ parts is possible but PHILIPS recommends strongly to
avoid mixed solder alloy types (leaded and lead-free).
If one cannot avoid or does not know whether product is
lead-free, clean carefully the solder-joint from old solder
alloy and re-solder with new solder alloy (SAC305).
•
Use only original spare-parts listed in the Service-Manuals.
Not listed standard-material (commodities) has to be
purchased at external companies.
•
Special information for BGA-ICs:
- always use the 12nc-recognizable soldering temperature
pro
fi
le of the speci
fi
c BGA (for de-soldering always use the
lead-free temperature pro
fi
le, in case of doubt)
- lead free BGA-ICs will be delivered in so-called ‘dry-
packaging’ (sealed pack including a silica gel pack) to
protect the IC against moisture. After opening, dependent
of MSL-level seen on indicator-label in the bag, the
BGA-IC possibly still has to be baked dry. (MSL=Moisture
Sensitivity Level). This will be communicated via AYS-
website.
Do not re-use BGAs at all.
•
For sets produced before 1.1.2005 (except products of
2004), containing leaded solder-alloy and components,
all needed spare-parts will be available till the end of the
service-period. For repair of such sets nothing changes.
•
On our website
www.atyourservice.ce.Philips.com
you
fi
nd more information to:
BGA-de-/soldering (+ baking instructions)
Heating-pro
fi
les of BGAs and other ICs used in Philips-sets
You
will
fi
nd this and more technical information within the
“magazine”, chapter “workshop news”.
For additional questions please contact your local repair-helpdesk.
