54
with down-looking camera
2. If there are couple of issues occur during test, some other points need to be considered
：
Frequent pickup failure. Some suggestions are listed below
1
The pick height is inappropriate, please revise the value after an inspection or a pick-test
；
2
The pick offset needs an adjustment, it should be aligned with the center of component reel slot rather than that of
component
；
3
Due to peel strength or installation issue of wasted film, the film on tape won’t be peeled completely
4
The nozzle was blocked and need cleaning
；
5
The nozzle is damaged or has a crack, which might cause air leakage
；
6
The size issue of nozzle is inappropriate, which would cause air leakage or insufficient suction
；
7
Insufficient air pressure or blockage of the air circuit, check whether the air circuit is leaking.
3. Frequently throwing components. Some suggestions are listed below
：
1
Incorrect image processing, images should be retaken
；
2
The pins are distorted
；
3
The size or shape isn’t aligned with that in “Footprint library’’
4
The size of nozzle is inappropriate or insufficient suction
；
5
The nozzle has solder paste or rubbish cause air leakage
；
6
The nozzle is damaged or cracked cause air leakage.
12.4 Continuous SMT production
Follow the SOP to start production
Notes:
Do not touch the surface of board to avoid damaging the printed solder paste.
When the error message occurs, please check out and solve it a.s.a.p.
