COMe-mAL10 – User Guide, Rev. 1.3
www.kontron.com
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Table of Contents
Symbols ................................................................................................................................................................................................................. 6
Table of Contents............................................................................................................................................................................................. 10
List of Tables ..................................................................................................................................................................................................... 12
List of Figures .................................................................................................................................................................................................... 12
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Introduction ......................................................................................................................................................................................... 13
1.1. Product Description................................................................................................................................................................................... 13
1.2. Product Naming Clarification ................................................................................................................................................................ 13
1.3. COM Express® Documentation ............................................................................................................................................................. 13
1.4. COM Express® Functionality ................................................................................................................................................................. 14
1.5. COM Express® Benefits ........................................................................................................................................................................... 14
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Product Specification ....................................................................................................................................................................... 15
2.1. Module Variants ........................................................................................................................................................................................ 15
2.1.1. Commercial Grade Modules (0°C to +60°C) ................................................................................................................................... 15
2.1.2. Industrial Temperature Grade Modules (E2, -40°C to +85°C) ................................................................................................ 15
2.2. Accessories ................................................................................................................................................................................................. 16
2.3. Functional Specifications ....................................................................................................................................................................... 17
2.3.1. Block Diagram COMe-mAL10 ............................................................................................................................................................. 17
2.3.2. Processors ............................................................................................................................................................................................... 18
2.3.3. Platform Controller Hub (PCH) ......................................................................................................................................................... 19
2.3.4. System Memory .................................................................................................................................................................................... 19
2.3.5. Graphics .................................................................................................................................................................................................... 19
2.3.6. LVDS.......................................................................................................................................................................................................... 20
2.3.7. Audio ......................................................................................................................................................................................................... 20
2.3.8. PCI Express (PCIE) Lanes [0-3] ........................................................................................................................................................ 20
2.3.9. USB ............................................................................................................................................................................................................. 21
2.3.10. SATA......................................................................................................................................................................................................... 21
2.3.11. Ethernet .................................................................................................................................................................................................. 22
2.3.12. COMe High-speed Serial Interfaces Overview ......................................................................................................................... 22
2.3.13. Storage Features ................................................................................................................................................................................ 23
2.3.14. BIOS/Software Features.................................................................................................................................................................. 23
2.3.15. COMe Features .................................................................................................................................................................................... 23
2.3.16. Kontron Features................................................................................................................................................................................ 23
2.4. Electrical Specification .......................................................................................................................................................................... 24
2.4.1. Power Supply Voltage Specification .............................................................................................................................................. 24
2.4.2. Power Management ........................................................................................................................................................................... 24
2.4.3. Power Supply Control Settings ....................................................................................................................................................... 25
2.4.4. Power Supply Modes .......................................................................................................................................................................... 25
2.5. Thermal Management ........................................................................................................................................................................... 27
2.5.1. Heatspreader Plate (HSP) Assembly and Metal Heat Slug ..................................................................................................... 27
2.5.2. Active/Passive Cooling Solutions ................................................................................................................................................... 27
2.5.3. Operating with Kontron Heatspreader Plate (HSP) Assembly.............................................................................................. 27
2.5.4. Operating without Kontron Heatspreader Plate (HSP) Assembly ....................................................................................... 27
2.5.5. On-board Fan Connector ................................................................................................................................................................... 27
2.6. Environmental Specification................................................................................................................................................................ 29
2.6.1. Humidity ................................................................................................................................................................................................... 29
2.7. Standards and Certifications ............................................................................................................................................................... 30
2.8. Mechanical Specification ....................................................................................................................................................................... 31
