29
Dual-Core Intel® Xeon® Processor 5200 Series Electrical Specifications
Notes:
1.
Unless otherwise noted, all specifications in this table are based on final silicon characterization data.
2.
These voltages are targets only. A variable voltage source should exist on systems in the event that a
different voltage is required. See
Section 2.5
for more information.
3.
The voltage specification requirements are measured across the VCC_DIE_SENSE and VSS_DIE_SENSE
lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands with an oscilloscope set to 100 MHz
bandwidth, 1.5 pF maximum probe capacitance, and 1 M
Ω
minimum impedance. The maximum length of
ground wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled
in the scope probe.
4.
The processor must not be subjected to any static V
CC
level that exceeds the V
CC_MAX
associated with any
particular current. Failure to adhere to this specification can shorten processor lifetime.
5.
I
CC_MAX
specification is based on maximum V
CC
loadline. Refer to
Figure 2-5
,
Figure 2-6
, and
Figure 2-11
for details. The processor is capable of drawing I
CC_MAX
for up to 10 ms. Refer to
Figure 2-1
for further
details on the average processor current draw over various time durations.
6.
FMB is the flexible motherboard guideline. These guidelines are for estimation purposes only. See
Section 2.13.1
for further details on FMB guidelines.
7.
This specification represents the total current for GTLREF_DATA and GTLREF_ADD.
8.
V
TT
must be provided via a separate voltage source and must not be connected to V
CC
. This specification is
measured at the land.
9.
Minimum V
CC
and maximum I
CC
are specified at the maximum processor case temperature (TCASE) shown
in
Figure 6-1
and
Figure 6-2
.
I
CC_TDC
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor X5200
Series
Launch - FMB
70
A
6,14
I
CC_TDC
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor E5200
Series
Launch - FMB
60
A
6,14
I
CC_TDC
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor L5200
Series
Launch - FMB
38
A
6,14
I
CC_TDC
Thermal Design Current
(TDC) Dual-Core Intel®
Xeon® Processor L5238
Launch - FMB
35
A
6,14
I
CC_VTT_OUT
DC current that may be
drawn from V
TT_OUT
per land
580
mA
16
I
CC_GTLREF
I
CC
for
GTLREF_DATA and
GTLREF_ADD
200
µA
7
I
CC_VCCPLL
I
CC
for PLL supply
130
mA
12
I
TCC
I
CC
for Dual-Core Intel®
Xeon® Processor X5200
Series during active thermal
control circuit (TCC)
90
A
I
TCC
I
CC
for Dual-Core Intel®
Xeon® Processor E5200
Series during active thermal
control circuit (TCC)
75
A
I
TCC
I
CC
for Dual-Core Intel®
Xeon® Processor L5200
Series during active thermal
control circuit (TCC)
50
A
I
TCC
I
CC
for Dual-Core Intel®
Xeon® Processor L5238
during active thermal control
circuit (TCC)
42
A
Table 2-12. Voltage and Current Specifications (Sheet 2 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
Notes
1, 11
Summary of Contents for L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray
Page 1: ...318590 005 Dual Core Intel Xeon Processor 5200 Series Datasheet August 2008...
Page 8: ...8 Dual Core Intel Xeon Processor 5200 Series Datasheet...
Page 14: ...14...
Page 92: ...Thermal Specifications 92...
Page 98: ...Features 98...
Page 102: ...Boxed Processor Specifications 102 Figure 8 4 Top Side Board Keepout Zones Part 1...
Page 103: ...103 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2...
Page 104: ...Boxed Processor Specifications 104 Figure 8 6 Bottom Side Board Keepout Zones...
Page 105: ...105 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones...
Page 106: ...Boxed Processor Specifications 106 Figure 8 8 Volumetric Height Keep Ins...
Page 112: ...Boxed Processor Specifications 112...
