Intel L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray, Datasheet

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4 Dual-Core Intel® Xeon® Processor 5200 Series Datasheet
6.2.1 Intel ® Thermal Monitor Features...............................................................85
6.2.2 On-Demand Mode...................................................................................87
6.2.3 PROCHOT# Signal ..................................................................................88
6.2.4 FORCEPR# Signal ...................................................................................88
6.2.5 THERMTRIP# Signal ................................................................................88
6.3 Platform Environment Control Interface (PECI) ......................................................89
6.3.1
Introduction...........................................................................................89
6.3.2 PECI Specifications .................................................................................90
7 Features ..................................................................................................................93
7.1
Power-On Configuration Options ..........................................................................93
7.2 Clock Control and Low Power States.....................................................................93
7.2.1
Normal State .........................................................................................94
7.2.2 HALT or Extended HALT State...................................................................94
7.2.3 Stop-Grant State ....................................................................................96
7.2.4 Extended HALT Snoop or HALT Snoop State,
Stop Grant Snoop State...........................................................................96
7.3 Enhanced Intel SpeedStep® Technology...............................................................97
8 Boxed Processor Specifications................................................................................99
8.1
Introduction......................................................................................................99
8.2 Mechanical Specifications.................................................................................. 101
8.2.1
Boxed Processor Heat Sink Dimensions (CEK)........................................... 101
8.2.2 Boxed Processor Heat Sink Weight .......................................................... 109
8.2.3 Boxed Processor Retention Mechanism and Heat Sink
Support (CEK)...................................................................................... 109
8.3 Electrical Requirements .................................................................................... 109
8.3.1
Fan Power Supply (Active CEK)............................................................... 109
8.3.2 Boxed Processor Cooling Requirements.................................................... 110
8.4 Boxed Processor Contents................................................................................. 111
9 Debug Tools Specifications .................................................................................... 113
9.1
Debug Port System Requirements ...................................................................... 113
9.2 Target System Implementation.......................................................................... 113
9.2.1
System Implementation......................................................................... 113
9.3 Logic Analyzer Interface (LAI) ........................................................................... 113
9.3.1
Mechanical Considerations ..................................................................... 114
9.3.2 Electrical Considerations ........................................................................ 114