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99

Boxed Processor Specifications

8

Boxed Processor Specifications

8.1

Introduction

Intel boxed processors are intended for system integrators who build systems from
components available through distribution channels. The Dual-Core Intel® Xeon®
Processor 5200 Series will be offered as an Intel boxed processor.

Intel will offer the Dual-Core Intel® Xeon® Processor 5200 Series with two heat sink
configurations available for each processor frequency: 1U passive/3U+ active
combination solution and a 2U passive only solution. The 1U passive/3U+ active
combination solution is based on a 1U passive heat sink with a removable fan that will
be pre-attached at shipping. This heat sink solution is intended to be used as either a
1U passive heat sink, or a 3U+ active heat sink. Although the active combination
solution with removable fan mechanically fits into a 2U keepout, its use is not
recommended in that configuration.

Dual-Core Intel® Xeon® Processor X5200 Series will include a copper 1U passive/3U+
active combination solution or a copper 2U passive heatsink. The Dual-Core Intel®
Xeon® Processor E5200 Series and Dual-Core Intel® Xeon® Processor L5200 Series
with 65W and lower TDPs will include an aluminum extruded 1U passive/3U+ active
combination solution or an aluminum extruded 2U passive heatsink.

The 1U passive/3U+ active combination solution in the active fan configuration is
primarily designed to be used in a pedestal chassis where sufficient air inlet space is
present and strong side directional airflow is not an issue. The 1U passive/3U+ active
combination solution with the fan removed and the 2U passive thermal solution require
the use of chassis ducting and are targeted for use in rack mount or pedestal servers.
The retention solution used for these products is called the Common Enabling Kit, or
CEK. The CEK base is compatible with both thermal solutions and uses the same hole
locations as the Intel

®

Xeon

®

processor with 800 MHz system bus.

The 1U passive/3U+ active combination solution will utilize a removable fan capable of
4-pin pulse width modulated (PWM) control. Use of a 4-pin PWM controlled active
thermal solution helps customers meet acoustic targets in pedestal platforms through
the motherboards’s ability to directly control the RPM of the processor heat sink fan.
See

Section 8.3

for more details on fan speed control, and see

Section 6.3

for more on

the PWM and PECI interface along with Digital Thermal Sensors (DTS).

Figure 8-1

through

Figure 8-3

are representations of the two heat sink solutions.

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Summary of Contents for L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray

Page 1: ...318590 005 Dual Core Intel Xeon Processor 5200 Series Datasheet August 2008...

Page 2: ...h may cause the product to deviate from published specifications Current characterized errata are available on request 64 bit computing on Intel architecture requires a computer system with a processo...

Page 3: ...1 DC Characteristics 24 2 10 2 Input Device Hysteresis 25 2 11 Mixing Processors 26 2 12 Absolute Maximum and Minimum Ratings 26 2 13 Processor DC Specifications 27 2 13 1 Flexible Motherboard Guidel...

Page 4: ...op Grant Snoop State 96 7 3 Enhanced Intel SpeedStep Technology 97 8 Boxed Processor Specifications 99 8 1 Introduction 99 8 2 Mechanical Specifications 101 8 2 1 Boxed Processor Heat Sink Dimensions...

Page 5: ...Coordinates Top View 45 3 7 Processor Land Coordinates Bottom View 46 6 1 Dual Core Intel Xeon Processor E5200 Series Thermal Profile 77 6 2 Dual Core Intel Xeon Processor X5200 Series Thermal Profile...

Page 6: ...e Loading Specifications 43 3 2 Package Handling Guidelines 44 3 3 Processor Materials 44 4 1 Land Listing by Land Name 47 4 2 Land Listing by Land Number 57 5 1 Signal Definitions 67 6 1 Dual Core In...

Page 7: ...Added product information for Dual Core Intel Xeon Processor L5238 March 2008 003 Added product information for Dual Core Intel Xeon Processor L5200 Series April 2008 004 Corrected L1 cache size Expo...

Page 8: ...8 Dual Core Intel Xeon Processor 5200 Series Datasheet...

Page 9: ...include Intel Wide Dynamic Execution enhanced floating point and multi media units Streaming SIMD Extensions 2 SSE2 Streaming SIMD Extensions 3 SSE3 and Streaming SIMD Extensions 4 1 SSE4 1 Advanced D...

Page 10: ...latform design guidelines for implementation details The Dual Core Intel Xeon Processor 5200 Series supports either 1333 MHz or 1600 MHz Front Side Bus operations The FSB utilizes a split transaction...

Page 11: ...used to call out specifications that are unique to the Dual Core Intel Xeon Processor E5200 Series SKU Dual Core Intel Xeon Processor L5200 Series Intel 64 bit microprocessor intended for dual proces...

Page 12: ...ose Processors may be sealed in packaging or exposed to free air Under these conditions processor lands should not be connected to any supply voltages have any I Os biased or receive any clocks Upon e...

Page 13: ...tact your Intel representative for the latest revision of these documents 2 Document is available publicly at http developer intel com Document Document Number1 Notes AP 485 Intel Processor Identifica...

Page 14: ...14...

Page 15: ...4X front side bus signaling group and GTLREF_ADD is used for the 2X and common clock front side bus signaling groups Both GTLREF_DATA and GTLREF_ADD must be generated on the baseboard See Table 2 18...

Page 16: ...istance ESR and the baseboard designer must assure a low interconnect resistance from the regulator EVRD or VRM pins to the LGA771 socket Bulk decoupling must be provided on the baseboard to handle la...

Page 17: ...g signal integrity requirements as outlined in Table 2 19 The Dual Core Intel Xeon Processor 5200 Series utilizes differential clocks Table 2 1 contains processor core frequency to FSB multipliers and...

Page 18: ...frequencies Individual processor VID values may be calibrated during manufacturing such that two devices at the same core frequency may have different default VID settings This is reflected by the VID...

Page 19: ...core voltage Transitions above the specified VID are not permitted Table 2 12 includes VID step sizes and DC shift ranges Minimum and maximum voltages must be maintained as shown in Table 2 13 The VR...

Page 20: ...1 0 1 2375 78 1 1 1 1 0 0 0 8625 3A 0 1 1 1 0 1 1 2500 76 1 1 1 0 1 1 0 8750 38 0 1 1 1 0 0 1 2625 74 1 1 1 0 1 0 0 8875 36 0 1 1 0 1 1 1 2750 72 1 1 1 0 0 1 0 9000 34 0 1 1 0 1 0 1 2875 70 1 1 1 0 0...

Page 21: ...iate platform design guidelines For unused AGTL input or I O signals use pull up resistors of the same value as the on die termination resistors RTT For details see Table 2 18 TAP CMOS Asynchronous in...

Page 22: ...nous data bus comes the need to specify two sets of timing parameters One set is for common clock signals whose timings are specified with respect to rising edge of BCLK0 ADS HIT HITM and so forth and...

Page 23: ...NSE VCC_DIE_SENSE2 VCCPLL VID_SELECT VSS_DIE_SENSE VSS_DIE_SENSE2 VSS VTT VTT_OUT VTT_SEL Table 2 6 FSB Signal Groups Sheet 2 of 2 Signal Group Type Signals1 Table 2 7 AGTL Signal Description Table AG...

Page 24: ...each signal may be required with each driving a different voltage level 2 10 Platform Environmental Control Interface PECI DC Specifications PECI is an Intel proprietary one wire interface that provi...

Page 25: ...2 10 PECI DC Electrical Limits Symbol Definition and Conditions Min Max Units Notes1 Vin Input Voltage Range 0 150 VTT V Vhysteresis Hysteresis 0 1 VTT N A V Vn Negative edge threshold voltage 0 275 V...

Page 26: ...2 Absolute Maximum and Minimum Ratings Table 2 11 specifies absolute maximum and minimum ratings only which lie outside the functional limits of the processor Only within specified operation limits ca...

Page 27: ...formation is presented graphically in Figure 2 5 and Figure 2 6 The FSB clock signal group is detailed in Table 2 19 BSEL 2 0 and VID 6 1 signals are specified in Table 2 14 The DC specifications for...

Page 28: ...Xeon Processor X5200 Series with multiple VID Launch FMB 90 A 4 5 6 9 ICC ICC for Dual Core Intel Xeon Processor E5200 Series with multiple VID Launch FMB 75 A 4 5 6 9 ICC ICC for Dual Core Intel Xeo...

Page 29: ...s are for estimation purposes only See Section 2 13 1 for further details on FMB guidelines 7 This specification represents the total current for GTLREF_DATA and GTLREF_ADD 8 VTT must be provided via...

Page 30: ...nd is not tested 15 This is the maximum total current drawn from the VTT plane by only one processor with RTT enabled This specification does not include the current coming from on board termination R...

Page 31: ...Xeon Processor E5200 Series andDual Core Intel Xeon Processor X5200 Series and Dual Core Intel Xeon Processor L5200 Series VCC Static and Transient Tolerance ICC A VCC_Max V VCC_Typ V VCC_Min V Notes...

Page 32: ...for socket load line guidelines and VR implementation Please refer to the appropriate platform design guide for details on VR implementation 4 ICC values greater than 75A are not applicable for the D...

Page 33: ...0 VID 0 100 VID 0 120 VID 0 140 VID 0 160 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 Icc A Vcc V VCC Maximum VCC Typical VCC Minimum VID 0 000 VID 0 010 VID 0 020 VID 0 030 VID 0 040 VID 0...

Page 34: ...asured at 0 31 VTT RON min 0 158 RTT RON typ 0 167 RTT RON max 0 175 RTT 6 GTLREF should be generated from VTT with a 1 tolerance resistor divider The VTT referred to in these specifications is the in...

Page 35: ..._SENSE lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands Notes 1 VOS is the measured overshoot voltage 2 TOS is the measured time duration above VID 2 13 3 Die Voltage Validation Core volta...

Page 36: ...e minimum and maximum specifications account for this resistor tolerance Refer to the appropriate platform design guidelines for implementation details The VTT referred to in these specifications is t...

Page 37: ...ions simultaneously 9 VHavg can be measured directly using Vtop on Agilent and High on Tektronix oscilloscopes 10 For VIN between 0 V and VH 11 VCROSS is defined as the total variation of all crossing...

Page 38: ...ng and Falling Edge Rates Crossing Voltage Threshold Region VH VL Overshoot Undershoot Ringback Margin Rising Edge Ringback Falling Edge Ringback BCLK0 BCLK1 Crossing Voltage Tp Tp T1 BCLK 1 0 period...

Page 39: ...shown in Figure 3 1 include the following Integrated Heat Spreader IHS Thermal Interface Material TIM Processor Core die Package Substrate Landside capacitors Package Lands Note This drawing is not t...

Page 40: ...ntial IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the processor Thermal Mechanical Design Guidelines Figure 3 2 Dual Core Intel Xeo...

Page 41: ...41 Mechanical Specifications Figure 3 3 Dual Core Intel Xeon Processor 5200 Series Package Drawing Sheet 2 of 3...

Page 42: ...Mechanical Specifications 42 Figure 3 4 Dual Core Intel Xeon Processor 5200 Series Package Drawing Sheet 3 of 3...

Page 43: ...ization Loading limits are for the LGA771 socket 4 Dynamic compressive load applies to all board thickness 5 Dynamic loading is defined as an 11 ms duration average load superimposed on the static loa...

Page 44: ...tion Specifications The Dual Core Intel Xeon Processor 5200 Series can be inserted and removed 15 times from an LGA771 socket which meets the criteria outlined in the LGA771 Socket Design Guidelines 3...

Page 45: ...GROUP1LINE4 GROUP1LINE5 ATPO S N Legend GROUP1LINE1 GROUP1LINE2 GROUP1LINE3 GROUP1LINE4 GROUP1LINE5 Mark Text Production Mark 3400DP 6M 1600 Intel Xeon Proc SXXX COO i M 06 FPO Figure 3 6 Processor La...

Page 46: ...21 22 23 24 25 26 27 28 29 30 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN 1 2 3 4 5 6...

Page 47: ...put A22 AD6 Source Sync Input Output A23 AA5 Source Sync Input Output A24 AB5 Source Sync Input Output A25 AC5 Source Sync Input Output A26 AB4 Source Sync Input Output A27 AF5 Source Sync Input Outpu...

Page 48: ...Output Table 4 1 Land Listing by Land Name Sheet 3 of 20 Pin Name Pin No Signal Buffer Type Direction D41 F20 Source Sync Input Output D42 E21 Source Sync Input Output D43 F21 Source Sync Input Outpu...

Page 49: ...Sync Input Output REQ2 M6 Source Sync Input Output REQ3 K6 Source Sync Input Output REQ4 J6 Source Sync Input Output RESERVED AM6 RESERVED A13 RESERVED A20 RESERVED A23 RESERVED AC4 RESERVED AE4 RESER...

Page 50: ...wer Other VCC AD29 Power Other VCC AD30 Power Other Table 4 1 Land Listing by Land Name Sheet 7 of 20 Pin Name Pin No Signal Buffer Type Direction VCC AD8 Power Other VCC AE11 Power Other VCC AE12 Pow...

Page 51: ...4 Power Other Table 4 1 Land Listing by Land Name Sheet 9 of 20 Pin Name Pin No Signal Buffer Type Direction VCC AL15 Power Other VCC AL18 Power Other VCC AL19 Power Other VCC AL21 Power Other VCC AL2...

Page 52: ...Power Other Table 4 1 Land Listing by Land Name Sheet 11 of 20 Pin Name Pin No Signal Buffer Type Direction VCC N27 Power Other VCC N28 Power Other VCC N29 Power Other VCC N30 Power Other VCC N8 Powe...

Page 53: ...ower Other VSS AB27 Power Other VSS AB28 Power Other Table 4 1 Land Listing by Land Name Sheet 13 of 20 Pin Name Pin No Signal Buffer Type Direction VSS AB29 Power Other VSS AB30 Power Other VSS AB7 P...

Page 54: ...27 Power Other Table 4 1 Land Listing by Land Name Sheet 15 of 20 Pin Name Pin No Signal Buffer Type Direction VSS AK28 Power Other VSS AK29 Power Other VSS AK30 Power Other VSS AK5 Power Other VSS AK...

Page 55: ...Power Other Table 4 1 Land Listing by Land Name Sheet 17 of 20 Pin Name Pin No Signal Buffer Type Direction VSS G1 Power Other VSS H10 Power Other VSS H11 Power Other VSS H12 Power Other VSS H13 Powe...

Page 56: ...3 Power Other VSS V30 Power Other Table 4 1 Land Listing by Land Name Sheet 19 of 20 Pin Name Pin No Signal Buffer Type Direction VSS V6 Power Other VSS V7 Power Other VSS W4 Power Other VSS W7 Power...

Page 57: ...28 VSS Power Other AA29 VSS Power Other AA3 VSS Power Other AA30 VSS Power Other AA4 A21 Source Sync Input Output AA5 A23 Source Sync Input Output AA6 VSS Power Other AA7 VSS Power Other AA8 VCC Power...

Page 58: ...ower Other Output Table 4 2 Land Listing by Land Number Sheet 3 of 20 Pin No Pin Name Signal Buffer Type Direction AE9 VCC Power Other AF1 TDO TAP Output AF10 VSS Power Other AF11 VCC Power Other AF12...

Page 59: ...wer Other Table 4 2 Land Listing by Land Number Sheet 5 of 20 Pin No Pin Name Signal Buffer Type Direction AH27 VCC Power Other AH28 VCC Power Other AH29 VCC Power Other AH3 VSS Power Other AH30 VCC P...

Page 60: ...4 2 Land Listing by Land Number Sheet 7 of 20 Pin No Pin Name Signal Buffer Type Direction AL18 VCC Power Other AL19 VCC Power Other AL2 PROCHOT Open Drain Output AL20 VSS Power Other AL21 VCC Power...

Page 61: ...ction B10 D10 Source Sync Input Output B11 VSS Power Other B12 D13 Source Sync Input Output B13 RESERVED B14 VSS Power Other B15 D53 Source Sync Input Output B16 D55 Source Sync Input Output B17 VSS P...

Page 62: ...D28 VTT Power Other Table 4 2 Land Listing by Land Number Sheet 11 of 20 Pin No Pin Name Signal Buffer Type Direction D29 VTT Power Other D3 VSS Power Other D30 VTT Power Other D4 HIT Common Clk Input...

Page 63: ...e Sync Input Output G19 DSTBP2 Source Sync Input Output Table 4 2 Land Listing by Land Number Sheet 13 of 20 Pin No Pin Name Signal Buffer Type Direction G2 RESERVED G20 DSTBN2 Source Sync Input Outpu...

Page 64: ...t Table 4 2 Land Listing by Land Number Sheet 15 of 20 Pin No Pin Name Signal Buffer Type Direction K2 VSS Power Other K23 VCC Power Other K24 VCC Power Other K25 VCC Power Other K26 VCC Power Other K...

Page 65: ...P8 VCC Power Other R1 RESERVED Table 4 2 Land Listing by Land Number Sheet 17 of 20 Pin No Pin Name Signal Buffer Type Direction R2 VSS Power Other R23 VSS Power Other R24 VSS Power Other R25 VSS Powe...

Page 66: ...C Power Other W24 VCC Power Other W25 VCC Power Other W26 VCC Power Other W27 VCC Power Other W28 VCC Power Other W29 VCC Power Other W3 RESERVED W30 VCC Power Other W4 VSS Power Other W5 A16 Source S...

Page 67: ...O write instruction it must be valid along with the TRDY assertion of the corresponding I O write bus transaction 2 ADS I O ADS Address Strobe is asserted to indicate the validity of the transaction a...

Page 68: ...BPM0 I O O I O O I O BPM 5 0 Breakpoint Monitor are breakpoint and performance monitor signals They are outputs from the processor which indicate the status of breakpoints and programmable counters us...

Page 69: ...for that 16 bit group 3 DBR O DBR is used only in systems where no debug port connector is implemented on the system board DBR is used by a debug port interposer so that an in target probe can drive...

Page 70: ...3 of the Intel 64 and IA 32 Architectures Software Developer s Manual and the Intel Processor Identification and the CPUID Instruction application note 2 FORCEPR I The FORCEPR force power reduction i...

Page 71: ...NMI becomes NMI a nonmaskable interrupt INTR and NMI are backward compatible with the signals of those names on the Pentium processor Both signals are asynchronous These signals must be software confi...

Page 72: ...hese signals 3 RESET I Asserting the RESET signal resets all processors to known states and invalidates their internal caches without writing back any of their contents For a power on Reset RESET must...

Page 73: ...PWRGOOD and is disabled on de assertion of PWRGOOD Once activated THERMTRIP remains latched until PWRGOOD is de asserted While the de assertion of the PWRGOOD signal will de assert THERMTRIP if the pr...

Page 74: ...n the Dual Core Intel Xeon Processor 5200 Series package VSS_DIE_SENSE VSS_DIE_SENSE2 O VSS_DIE_SENSE and VSS_DIE_SENSE2 provides an isolated low impedance connection to the processor core power and g...

Page 75: ...file see Table 6 1 and Figure 6 1 for the Dual Core Intel Xeon Processor E5200 Series Table 6 3 and Figure 6 2 for the Dual Core Intel Xeon Processor X5200 Series Table 6 6 and Figure 6 3 for the Dual...

Page 76: ...olution that does not meet Thermal Profile B will violate the thermal specifications and may result in permanent damage to the processor Intel has developed these thermal profiles to allow customers t...

Page 77: ...frequency requirements Notes 1 Please refer to Table 6 2 for discrete points that constitute the thermal profile 2 Implementation of the Dual Core Intel Xeon Processor E5200 Series Thermal Profile sh...

Page 78: ...ilicon characterization 4 Power specifications are defined at all VIDs found in Table 2 12 The Dual Core Intel Xeon Processor X5200 Series may be shipped under multiple VIDs for each frequency 5 FMB o...

Page 79: ...Mechanical Design Guidelines TMDG for system and environmental implementation details Figure 6 2 Dual Core Intel Xeon Processor X5200 Series Thermal Profiles A and B 40 45 50 55 60 65 70 0 10 20 30 4...

Page 80: ...Power specifications are defined at all VIDs found in Table 2 12 The Dual Core Intel Xeon Processor L5200 Series may be shipped under multiple VIDs for each frequency 5 FMB or Flexible Motherboard gu...

Page 81: ...of TCC activation and may incur measurable performance loss See Section 6 2 for details on TCC activation 3 Refer to the Dual Core Intel Xeon Processor 5200 Series Thermal Mechanical Design Guideline...

Page 82: ...et the processor Thermal Profile will result in increased probability of TCC activation and may incur measurable performance loss See Section 6 2 for details on TCC activation 3 The Nominal Thermal Pr...

Page 83: ...ncy 5 FMB or Flexible Motherboard guidelines provide a design target for meeting all planned processor frequency requirements Notes 1 Dual Core Intel Xeon Processor L5215 Thermal Profile is representa...

Page 84: ...es at the Short Term Thermal Profile for a duration longer than the limits specified in Note 4 above do not meet the processor thermal specifications and may result in permanent damage to the processo...

Page 85: ...el Thermal Monitor 2 is not effective 6 2 1 1 Intel Thermal Monitor 1 The Intel Thermal Monitor 1 feature helps control the processor temperature by activating the Thermal Control Circuit TCC when the...

Page 86: ...itor 2 This mechanism provides an efficient means for limiting the processor temperature by reducing the power consumption within the processor Intel Thermal Monitor 2 requires support for dynamic VID...

Page 87: ...Transition of the VID code will occur first in order to insure proper operation once the processor reaches its normal operating frequency Refer to Figure 6 7 for an illustration of this ordering The P...

Page 88: ...annot be adjusted based on experimental measurements of TCASE or PROCHOT 6 2 4 FORCEPR Signal The FORCEPR force power reduction input can be used by the platform to cause the Dual Core Intel Xeon Proc...

Page 89: ...solutions based on PECI utilize a TCONTROL value stored in the processor IA32_TEMPERATURE_TARGET MSR The TCONTROL MSR uses the same offset temperature format as PECI though it contains no sign bit The...

Page 90: ...The key items to take into account when settling on a fan control algorithm are the DTS sample rate whether the temperature filter is enabled how often the PECI host will poll the processor for temper...

Page 91: ...ocessor operation during the time frame when reliable data is not available via PECI To protect platforms from potential operational or safety issues due to an abnormal condition on PECI the Host cont...

Page 92: ...Thermal Specifications 92...

Page 93: ...o the HALT state and Stop Grant state to reduce power consumption by stopping the clock to internal sections of the processor depending on each particular state See Figure 7 1 for a visual representat...

Page 94: ...essor will process front side bus snoops and interrupts 7 2 2 2 Extended HALT State Extended HALT state is a low power state entered when all processor cores have executed the HALT or MWAIT instructio...

Page 95: ...original value PEXTENDED_HALT Dual Core Intel Xeon Processor E5240 Extended HALT State Power 8 W 2 PEXTENDED_HALT Dual Core Intel Xeon Processor L5200 Series Extended HALT State Power 6 W 2 PEXTENDED...

Page 96: ...y serviced when the processor returns to the Normal state Only one occurrence of each event will be recognized upon return to the Normal state While in Stop Grant state the processor will process snoo...

Page 97: ...ility states within the Normal state see Figure 7 1 for the Stop Clock State Machine for supported P states Enhanced Intel SpeedStep Technology enables real time dynamic switching between frequency an...

Page 98: ...Features 98...

Page 99: ...nd lower TDPs will include an aluminum extruded 1U passive 3U active combination solution or an aluminum extruded 2U passive heatsink The 1U passive 3U active combination solution in the active fan co...

Page 100: ...cifications 100 Figure 8 1 Boxed Dual Core Intel Xeon Processor 5200 Series 1U Passive 3U Active Combination Heat Sink With Removable Fan Figure 8 2 Boxed Dual Core Intel Xeon Processor 5200 Series 2U...

Page 101: ...mechanical specifications of the boxed processor 8 2 1 Boxed Processor Heat Sink Dimensions CEK The boxed processor will be shipped with an unattached thermal solution Clearance is required around th...

Page 102: ...Boxed Processor Specifications 102 Figure 8 4 Top Side Board Keepout Zones Part 1...

Page 103: ...103 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2...

Page 104: ...Boxed Processor Specifications 104 Figure 8 6 Bottom Side Board Keepout Zones...

Page 105: ...105 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones...

Page 106: ...Boxed Processor Specifications 106 Figure 8 8 Volumetric Height Keep Ins...

Page 107: ...107 Boxed Processor Specifications Figure 8 9 4 Pin Fan Cable Connector For Active CEK Heat Sink...

Page 108: ...Boxed Processor Specifications 108 Figure 8 10 4 Pin Base Board Fan Header For Active CEK Heat Sink...

Page 109: ...loads from the heat sink are transferred to the chassis pan via the stiff screws and standoffs The retention scheme reduces the risk of package pullout and solder joint failures All components of the...

Page 110: ...1U Passive 3U Active Combination Heat Sink Solution 1U Rack Passive In the 1U configuration it is assumed that a chassis duct will be implemented to provide a minimum airflow of 15 cfm at 0 38 in H2O...

Page 111: ...d by other system components Meeting the processor s temperature specification is the responsibility of the system integrator 8 3 2 3 2U Passive Heat Sink Solution 2U Rack or Pedestal In the 2U passiv...

Page 112: ...Boxed Processor Specifications 112...

Page 113: ...neral the information in this chapter may be used as a basis for including all run control tools in Dual Core Intel Xeon Processor 5200 Series based system designs including tools from vendors other t...

Page 114: ...ke sure that the keepout volume remains unobstructed inside the system Note that it is possible that the keepout volume reserved for the LAI may include differerent requirements from the space normall...

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