Intel L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray, Datasheet

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Thermal Specifications
80
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
at specified ICC. Please refer to the loadline specifications in Section 2.13 .
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4. Power specifications are defined at all VIDs found in Table 2-12 . The Dual-Core Intel® Xeon® Processor
L5200 Series may be shipped under multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
50 54.0
55 55.1
60 56.3
65 57.5
70 58.7
75 59.8
80 61.0
Table 6-5. Dual-Core Intel® Xeon® Processor X5200 Series Thermal B Profile Table
Power (W) T
CASE_MAX
( ° C)
0 42.9
5 44.3
10 45.8
15 47.2
20 48.7
25 50.1
30 51.6
35 53.0
40 54.5
45 55.9
50 57.4
55 58.8
60 60.2
65 61.7
70 63.1
75 64.6
80 66.0
Table 6-6. Dual-Core Intel® Xeon® Processor L5200 Series Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 40 5 See Figure 6-3 ; Table 6-7 1, 2, 3, 4, 5
Table 6-4. Dual-Core Intel® Xeon® Processor X5200 Series Thermal A Profile Table
(Sheet 2 of 2)
Power (W) T
CASE_MAX
( ° C)