Intel L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray, Datasheet

Page: 44 / 114

Mechanical Specifications
44
3.4 Package Handling Guidelines
Table 3-2 includes a list of guidelines on a package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5. Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5 Package Insertion Specifications
The Dual-Core Intel® Xeon® Processor 5200 Series can be inserted and removed 15
times from an LGA771 socket, which meets the criteria outlined in the LGA771 Socket
Design Guidelines.
3.6 Processor Mass Specifications
The typical mass of the Dual-Core Intel® Xeon® Processor 5200 Series is 21.5 grams
[0.76 oz.]. This includes all components which make up the entire processor product.
3.7 Processor Materials
The Dual-Core Intel® Xeon® Processor 5200 Series is assembled from several
components. The basic material properties are described in
Table 3-3 .
3.8 Processor Markings
Figure 3-5 shows the topside markings on the processor. This diagram aids in the
identification of the Dual-Core Intel® Xeon® Processor 5200 Series.
Table 3-2. Package Handling Guidelines
Parameter Maximum Recommended Units Notes
Shear 311
70
N
lbf
1,4,5
Tensile 111
25
N
lbf
2,4,5
Torque 3.95
35
N-m
LBF-in
3,4,5
Table 3-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel over copper
Substrate Fiber-reinforced resin
Substrate Lands Gold over nickel