Thermal Specifications
82
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
at specified ICC. Please refer to the loadline specifications in
Section 2.13
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4.
Power specifications are defined at all VIDs found in
Table 2-12
. The Dual-Core Intel® Xeon® Processor
L5238 may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Dual-Core Intel® Xeon® Processor L5238 Thermal Profile is representative of a volumetrically constrained
platform. Please refer to
Table 6-9
for discrete points that constitute the thermal profile.
2.
Implementation of the Dual-Core Intel® Xeon® Processor L5238 Thermal Profile should result in virtually
no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor Thermal
Profile will result in increased probability of TCC activation and may incur measurable performance loss.
(See
Section 6.2
for details on TCC activation).
3.
The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
4.
The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances
per year, as compliant with NEBS Level 3.
5.
Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the
Short-Term Thermal Profile for a duration longer than the limits specified in Note 4 above, do not meet the
processor thermal specifications and may result in permanent damage to the processor.
6.
Refer to the Dual-Core Intel® Xeon® Processor 5200 Series in Embedded Thermal/Mechanical Design
Guidelines (TMDG) for system and environmental implementation details.
Table 6-8.
Dual-Core Intel® Xeon® Processor L5238 Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
35
5
See
Figure 6-4
;
Table 6-8
1, 2, 3, 4, 5
Figure 6-4. Dual-Core Intel® Xeon® Processor L5238 Thermal Profile
Thermal Profile
30
40
50
60
70
80
90
100
0
5
10
15
20
25
30
35
Power (W)
T
CAS
E
(C
)
Nominal
Short Term
T
CASE
= 0.741 * P + 45
T
CASE
= 0.741 * P + 60
T
CASE-MAX
@ TDP
Short-term Thermal Profile may only be used for short term
excursions to higher ambient temperatures, not to exceed
360 hours per year
Summary of Contents for L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray
Page 1: ...318590 005 Dual Core Intel Xeon Processor 5200 Series Datasheet August 2008...
Page 8: ...8 Dual Core Intel Xeon Processor 5200 Series Datasheet...
Page 14: ...14...
Page 92: ...Thermal Specifications 92...
Page 98: ...Features 98...
Page 102: ...Boxed Processor Specifications 102 Figure 8 4 Top Side Board Keepout Zones Part 1...
Page 103: ...103 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2...
Page 104: ...Boxed Processor Specifications 104 Figure 8 6 Bottom Side Board Keepout Zones...
Page 105: ...105 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones...
Page 106: ...Boxed Processor Specifications 106 Figure 8 8 Volumetric Height Keep Ins...
Page 112: ...Boxed Processor Specifications 112...
