37
Dual-Core Intel® Xeon® Processor 5200 Series Electrical Specifications
Notes:
1.
Unless otherwise noted, all specifications in this table apply to all processor frequencies.
2.
Crossing Voltage is defined as the instantaneous voltage value when the rising edge of BCLK0 is equal to
the falling edge of BCLK1.
3.
V
Havg
is the statistical average of the V
H
measured by the oscilloscope.
4.
Overshoot is defined as the absolute value of the maximum voltage.
5.
Undershoot is defined as the absolute value of the minimum voltage.
6.
Ringback Margin is defined as the absolute voltage difference between the maximum Rising Edge Ringback
and the maximum Falling Edge Ringback.
7.
Threshold Region is defined as a region entered around the crossing point voltage in which the differential
receiver switches. It includes input threshold hysteresis.
8.
The crossing point must meet the absolute and relative crossing point specifications simultaneously.
9.
V
Havg
can be measured directly using “Vtop” on Agilent and “High” on Tektronix oscilloscopes.
10. For V
IN
between 0 V and V
H
.
11.
Δ
V
CROSS
is defined as the total variation of all crossing voltages as defined in note 3.
12. Measured from -200 mV to +200 mV on the differential waveform (derived from minus REFCLK-).
The signal must be monotonic through the measurement region for rise and fall time. The 400 mV
measurement window is centered on the differential zero crossing. See
Figure 2-12
.
V
OS
Overshoot
N/A
N/A
1.150
V
2-10
4
V
US
Undershoot
-0.300
N/A
N/A
V
2-10
5
V
RBM
Ringback Margin
0.200
N/A
N/A
V
2-10
6
V
TR
Threshold Region
V
CROSS
-
0.100
N/A
V
CROSS
+ 0.100
V
2-10
7
I
LI
Input Leakage Current
N/A
N/A
± 100
μ
A
10
ERRefclk-diffRrise
ERRefclk-diff-Fall
Differential Rising and
falling edge rates
0.6
4
V/ns
2-12
12
Table 2-19. FSB Differential BCLK Specifications (Sheet 2 of 2)
Symbol
Parameter
Min
Typ
Max
Unit
Figure
Notes
1
Figure 2-9. Electrical Test Circuit
Vtt
55 Ohms, 160 ps/in, 600 mils
0.3nH
0.9nH
0.6nH
Rtt = 55 Ohms
1.3pF
0.2pF
AC Timings specified at this point (@ Buffer pad)
Vtt
Buffer
Long Package
R
Load
Summary of Contents for L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray
Page 1: ...318590 005 Dual Core Intel Xeon Processor 5200 Series Datasheet August 2008...
Page 8: ...8 Dual Core Intel Xeon Processor 5200 Series Datasheet...
Page 14: ...14...
Page 92: ...Thermal Specifications 92...
Page 98: ...Features 98...
Page 102: ...Boxed Processor Specifications 102 Figure 8 4 Top Side Board Keepout Zones Part 1...
Page 103: ...103 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2...
Page 104: ...Boxed Processor Specifications 104 Figure 8 6 Bottom Side Board Keepout Zones...
Page 105: ...105 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones...
Page 106: ...Boxed Processor Specifications 106 Figure 8 8 Volumetric Height Keep Ins...
Page 112: ...Boxed Processor Specifications 112...
