Thermal Specifications
84
2.
Implementation of the Dual-Core Intel® Xeon® Processor L5215 Thermal Profile should result in virtually
no TCC activation. Furthermore, utilization of thermal solutions that do not meet the processor Thermal
Profile will result in increased probability of TCC activation and may incur measurable performance loss.
(See
Section 6.2
for details on TCC activation).
3.
The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
4.
The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 96 hours per instance, 360 hours per year, and a maximum of 15 instances
per year, as compliant with NEBS Level 3.
5.
Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the
Short-Term Thermal Profile for a duration longer than the limits specified in Note 4 above, do not meet the
processor thermal specifications and may result in permanent damage to the processor.
6.
Refer to the Dual-Core Intel® Xeon® Processor 5200 Series in Embedded Thermal/Mechanical Design
Guidelines (TMDG) for system and environmental implementation details.
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (T
CASE
) are specified in
Table 6-2
,
Table 6-4
,
Table 6-5
,
Table 6-7
, and
Table 6-9
are measured at the geometric top
center of the processor integrated heat spreader (IHS).
Figure 6-6
illustrates the
location where T
CASE
temperature measurements should be made. For detailed
guidelines on temperature measurement methodology, refer to the Dual-Core Intel®
Xeon® Processor 5200 Series Thermal/Mechanical Design Guidelines (TMDG).
Table 6-11. Dual-Core Intel® Xeon® Processor L5215 Thermal Profile Table
Power (W)
Nominal T
CASE_MAX
(
°
C)
Short-term T
CASE_MAX
(
°
C)
0
45
60
2
48
63
4
51
66
6
54
69
8
57
72
10
60
75
12
63
78
14
66
81
16
69
84
18
72
87
20
75
90
Summary of Contents for L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray
Page 1: ...318590 005 Dual Core Intel Xeon Processor 5200 Series Datasheet August 2008...
Page 8: ...8 Dual Core Intel Xeon Processor 5200 Series Datasheet...
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Page 92: ...Thermal Specifications 92...
Page 98: ...Features 98...
Page 102: ...Boxed Processor Specifications 102 Figure 8 4 Top Side Board Keepout Zones Part 1...
Page 103: ...103 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2...
Page 104: ...Boxed Processor Specifications 104 Figure 8 6 Bottom Side Board Keepout Zones...
Page 105: ...105 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones...
Page 106: ...Boxed Processor Specifications 106 Figure 8 8 Volumetric Height Keep Ins...
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