83
Thermal Specifications
Notes:
1.
These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds V
CC_MAX
at specified ICC. Please refer to the loadline specifications in
Section 2.13
.
2.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3.
These specifications are based pre-silicon estimates and simulations. These specifications will be updated
with characterized data from silicon measurements in a future release of this document.
4.
Power specifications are defined at all VIDs found in
Table 2-12
. The Dual-Core Intel® Xeon® Processor
L5215 may be shipped under multiple VIDs for each frequency.
5.
FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1.
Dual-Core Intel® Xeon® Processor L5215 Thermal Profile is representative of a volumetrically constrained
platform. Please refer to
Table 6-11
for discrete points that constitute the thermal profile.
Table 6-9.
Dual-Core Intel® Xeon® Processor L5238 Thermal Profile Table
Power (W)
Nominal T
CASE_MAX
(
°
C)
Short-term T
CASE_MAX
(
°
C)
0
45
60
5
49
64
10
52
67
15
56
71
20
60
75
25
64
79
30
67
82
35
71
86
Table 6-10. Dual-Core Intel® Xeon® Processor L5215 Thermal Specifications
Core
Frequency
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB
20
5
See
Figure 6-5
;
Table 6-11
1, 2, 3, 4, 5
Figure 6-5. Dual-Core Intel® Xeon® Processor L5215 Thermal Profile
Thermal Profile
30
40
50
60
70
80
90
100
0
5
10
15
20
Power (W)
T
CASE
(C
)
Nominal
Short Term
T
CASE
= 1.5 * P + 45
T
CASE
= 1.5 * P + 60
T
CASE-MAX
@ TDP
Short-term Thermal Profile may only be used for
short term excursions to higher am bient
temperatures, not to exceed 360 hours per year
Summary of Contents for L5310 - Cpu Xeon Quad-Core Lv 1.6Ghz Fsb1066Mhz 8M Fc-Lga6 Tray
Page 1: ...318590 005 Dual Core Intel Xeon Processor 5200 Series Datasheet August 2008...
Page 8: ...8 Dual Core Intel Xeon Processor 5200 Series Datasheet...
Page 14: ...14...
Page 92: ...Thermal Specifications 92...
Page 98: ...Features 98...
Page 102: ...Boxed Processor Specifications 102 Figure 8 4 Top Side Board Keepout Zones Part 1...
Page 103: ...103 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2...
Page 104: ...Boxed Processor Specifications 104 Figure 8 6 Bottom Side Board Keepout Zones...
Page 105: ...105 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones...
Page 106: ...Boxed Processor Specifications 106 Figure 8 8 Volumetric Height Keep Ins...
Page 112: ...Boxed Processor Specifications 112...
