LGA1156 Socket
26
Thermal/Mechanical Specifications and Design Guidelines
.
3.5.1
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in
Similarly, a seating plane on the top-side of the socket establishes the minimum
package height. See
for the calculated IHS height above the motherboard.
3.6
Durability
The socket must withstand 20 cycles of processor insertion and removal. The max
chain contact resistance from
must be met when mated in the 1st and 20th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
Figure 3-7. Package Installation / Removal Features
Pin 1
Chamfer
Package
Pin 1
Indicator
Alignment
Post
(2 Places)
Finger
Access
(2 Places)
Orientation
Notch
(2 Places)
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
