Thermal Specifications
50
Document Number: 424077 Revision: 2.0Thermal/Mechanical
Specifications and Design Guidelines
Temperature readings from the processor are always negative in a 2’s complement
format, and imply an offset from the reference TCC activation temperature. As an
example, assume that the TCC activation temperature reference is 100 °C. A PECI
thermal reading of -10 indicates that the processor is running at approximately 10 °C
below the TCC activation temperature, or 90 °C. PECI temperature readings are not
reliable at temperatures above TCC activation (since the processor is operating out of
specification at this temperature). Therefore, the readings are never positive.
Note that changes in PECI data counts are approximately linear in relation to changes
in temperature in degrees centigrade. A change of ‘1’ in the PECI count represents
roughly a temperature change of 1 degree centigrade. This linearity is approximate and
cannot be ensured over the entire range of PECI temperatures, especially as the delta
from the maximum PECI temperature (zero) increases.
6.3.3.3
Processor Thermal Data Sample Rate and Filtering
The processor digital thermal sensor (DTS) provides an improved capability to monitor
device hot spots, which inherently leads to more varying temperature readings over
short time intervals. To reduce the sample rate requirements on PECI and improve
thermal data stability versus time the processor DTS implements an averaging
algorithm that filters the incoming data before reporting it over PECI.
6.3.3.4
Reserved Values
Several values well out of the operational range are reserved to signal temperature
sensor errors. These are summarized in
§
Table 6-7.
Error Codes and Descriptions
Error Code
Description
8000h
General Sensor Error (GSE)
8002h
Sensor is operational, but has detected a temperature below its operational range
(underflow)
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
