1U Collaboration Thermal Solution
60
Collaboration thermal solution
Ψ
ca(mean+3sigma) is computed to 0.319°C/W at the
airflow of 15 CFM. As the
shown when T
LA
is 40 °C, equation representing
thermal solution of this heatsink is calculated as:
Y=0.319*X+40
where,
Y=Processor T
CASE
Value (°C)
X=Processor Power Value (W)
shows thermal solution performance is compliant with Intel
®
Xeon
®
processor 3400 series(95W) TTV thermal profile specification. At the TDP(95W) with
local ambient of 40°C, there is a 2.4 °C margin.
Note:
Intel
®
Xeon
®
processor 3400 series (95W) TTV thermal profile is the worst case of
LGA1156 Processors.
Figure 8-1. 1U Heatsink Performance Curves
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
