Thermal Specifications
44
Document Number: 424077 Revision: 2.0Thermal/Mechanical
Specifications and Design Guidelines
6.1.4
Thermal Metrology
The maximum TTV case temperatures (T
CASE-MAX
) can be derived from the data in the
appropriate TTV thermal profile earlier in this chapter. The TTV T
CASE
is measured at the
geometric top center of the TTV integrated heat spreader (IHS).
illustrates
the location where T
CASE
temperature measurements should be made. See
for drawings showing the thermocouple attach to the TTV package.
Note:
The following supplier can machine the groove and attach a thermocouple to the IHS.
The supplier is listed the table below as a convenience to Intel’s general customers and
the list may be subject to change without notice. THERM-X OF CALIFORNIA, 1837
Whipple Road, Hayward, Ca 94544. Ernesto B Va1-510-441-7566 Ext. 242
[email protected]. The vendor part number is XTMS1565.
6.2
Processor Thermal Features
6.2.1
Processor Temperature
A new feature in the processors is a software readable field in the
IA32_TEMPERATURE_TARGET register that contains the minimum temperature at
which the TCC will be activated and PROCHOT# will be asserted. The TCC activation
temperature is calibrated on a part-by-part basis and normal factory variation may
result in the actual TCC activation temperature being higher than the value listed in the
register. TCC activation temperatures may change based on processor stepping,
frequency or manufacturing efficiencies.
6.2.2
Adaptive Thermal Monitor
The Adaptive Thermal Monitor feature provides an enhanced method for controlling the
processor temperature when the processor silicon exceeds the Thermal Control Circuit
(TCC) activation temperature. Adaptive Thermal Monitor uses TCC activation to reduce
processor power via a combination of methods. The first method (Frequency/VID
Figure 6-3. TTV Case Temperature (T
CASE
) Measurement Location
37.5
3
7.5
Measure T
CASE
at
the geometric
center of the
package
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
