Thermal/Mechanical Specifications and Design Guidelines
17
Package Mechanical and Storage Specifications
2.1.9
Processor Land Coordinates
shows the bottom view of the processor package.
.
Figure 2-4. Processor Package Lands Coordinates
AY
AV
AT
AP
AM
AK
AH
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AD
AB
Y
V
T
P
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D
B
AW
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AR
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AA
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C
A
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11 13 15 17 19 21 23
25 27 29 31 33 35 37 39
2
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26 28 30 32 34 36 38 40
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
