Thermal/Mechanical Specifications and Design Guidelines
9
Introduction
1
Introduction
This document differs from previous Thermal and Mechanical Design Guidelines. In this
document, mechanical and thermal specifications for the processor and the associated
socket are now included. The usual design guidance has been retained.
The components described in this document include:
• The thermal and mechanical specifications for the
— Intel
®
Xeon
®
processor 3400 series
• The LGA1156 socket and the Independent Loading Mechanism (ILM) and back
plate.
• The collaboration design thermal solution (heatsink) for the processors and
associated retention hardware.
The Intel
®
Xeon
®
processor 3400 series has two thermal specifications. When required
for clarity this document will use Intel
®
Xeon
®
processor 3400 series (95W) or Intel
®
Xeon
®
processor 3400 series (45W).
Note:
For Workstation segment, since boundary conditions, ILM assembly and reference
thermal solution etc. are similar to Desktop’s corresponding parts, user could refer to
Intel
®
Core™ i7-800 and i5-700 Desktop Processor Series and LGA1156 Socket
Thermal/Mechanical Specifications and Design Guidelines.
Note:
When the information is applicable to all products, the this document will use
“processor” or “processors” to simplify the document.
1.1
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1.
Reference Documents
Document
Location
Intel
®
Xeon
®
Processor 3400 Series Datasheet, Volume 1
www.intel.com/Assets/
PDF/datasheet/322371.pdf
Intel
®
Xeon
®
Processor 3400 Series Datasheet, Volume 2
www.intel.com/Assets/
PDF/datasheet/322372.pdf
Intel
®
Xeon
®
Processor 3400 Series Specification Update
www.intel.com/Assets/
PDF/specupdate/
322173.pdf
Intel
®
5 Series Chipset and Intel
®
3400 Chipset Datasheet
www.intel.com/Assets/
PDF/datasheet/322169.pdf
Intel
®
5 Series Chipset and Intel
®
3400 Chipset Specification Update
www.intel.com/Assets/
PDF/specupdate/
322170.pdf
Intel
®
5 Series Chipset and Intel
®
3400 Chipset – Thermal Mechanical
Specifications and Design Guidelines
www.intel.com/Assets/
PDF/designguide/
322171.pdf
4-Wire Pulse Width Modulation (PWM) Controlled Fans
http://
www.formfactors.org/
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
