Thermal/Mechanical Specifications and Design Guidelines
107
Package Mechanical Drawings
§
Figure D-2. Processor Package Drawing (Sheet 2 of 2)
.
H
G
F
E
D
C
B
A
H
G
F
E
D
C
B
A
8 7 6 5
4 3 2
8 7 6 5
4 3 2
1
H
G
F
H
F
H
G
C
T 1
T 2
V 1
V 2
19.68
11.95
9.84
5.975
R1
R2
1.06
MAX ALLOWABLE
COMPONENT HEIGHT
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
E22526
2
6
DWG. NO
SHT.
REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
SIZE
DRAWING NUMBER
REV
A1
E22526
6
SCALE:
6
DO NOT SCALE DRAWING
SHEET
2
OF
2
D
E
0.23
C
F
H
JK
J
K
DETAIL
D
SCALE
20
0.23
C
G
H
MN
N
M
DETAIL
E
SCALE
20
SYMBOL
MILLIMETERS
COMMENTS
MIN
MAX
R 1
R1.09 BASIC
R 2
R1.09 BASIC
T 1
9.75 BASIC
T 2
0.2 BASIC
V 1
9.75 BASIC
V 2
0.2 BASIC
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
