Package Mechanical and Storage Specifications
18
Thermal/Mechanical Specifications and Design Guidelines
2.2
Processor Storage Specifications
includes a list of the specifications for device storage in terms of maximum
and minimum temperatures and relative humidity. These conditions should not be
exceeded in storage or transportation.
.
Notes:
1.
Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2.
Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in
applicable JEDEC standard and MAS document. Non-adherence may affect processor reliability.
3.
T
ABSOLUTE STORAGE
applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags or desiccant.
4.
Intel
®
branded board products are certified to meet the following temperature and humidity limits that are
given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%,
non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not
specified for non-Intel branded boards.
5.
The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
6.
Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by T
SUSTAINED
and customer shelf life in applicable Intel box and bags.
§
Table 2-4.
Storage Conditions
Parameter Description
Min
Max
Notes
T
ABSOLUTE STORAGE
The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when subjected to for any length of
time.
-55 °C
125 °C
T
SUSTAINED STORAGE
The ambient storage temperature limit (in
shipping media) for a sustained period of time.
-5 °C
40 °C
RH
SUSTAINED STORAGE
The maximum device storage relative humidity
for a sustained period of time.
60% @ 24 °C
TIME
SUSTAINED STORAGE
A prolonged or extended period of time;
typically associated with customer shelf life.
0
Months
6
Months
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
