1U Collaboration Thermal Solution
64
8.4
Geometric Envelope for 1U Thermal Mechanical
Design
8.5
Thermal Interface Material
A thermal interface material (TIM) provides conductivity between the IHS and heatsink.
The collaboration thermal solution uses Honeywell PCM45F, which pad size is
35x35 mm.
TIM should be verified to be within its recommended shelf life before use. Surfaces
should be free of foreign materials prior to application of TIM.
§
Figure 8-4. KOZ 3-D Model (Top) in 1U Server
2.5mm Maximum
Component Height
(6 places)
1.2mm Maximum
Component Height
(1 place)
1.6mm Maximum
Component Height
(2 places)
9.5mm Maximum
Component Height
(5 places)
2.07mm Maximum
Component Height
(1 place)
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
