Socket Mechanical Drawings
100
Thermal/Mechanical Specifications and Design Guidelines
Figure C-1. Socket Mechanical Drawing (Sheet 1 of 4)
8 7 6 5
4 3 2
H
G
F
E
D
C
B
A
8 7 6 5
4 3 2
1
H
G
F
E
D
C
B
A
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
NOTES: 1. THE PURPOSE OF THIS DRAWING IS TO ESTABLISH THE MECHANICAL FORM FACTOR OF THE SOCKET. THIS DRAWING IS NOT INTENDED TO SHOW INTERNAL DETAIL OF THE SOCKET WHICH MAY VARY FROM SUPPLIER TO SUPPLIER.
2. MATERIAL: BASE AND CAP: HIGH TEMPERATURE THERMOPLASTIC. UL94V-0 CONTACT: HIGH STRENGTH COPPER ALLOY POSTS: HIGH TEMPERATURE THERMOPLASTIC UL94V-0 SOLDER BALL: LEAD FREE SAC
3. FINISH: NONE
4. CONTACT MUST REMAIN ON LAND THROUGHOUT ACTUATION STROKE.
5. REMOVE ALL BURRS AND SHARP EDGES R0.05 MAX.
6 SOCKET NAME TO BE INDICATED IN THIS AREA.
7 LOT NUMBER SHALL BE INDICATED IN THIS AREA.
8 CHAMFER INDICATES THE CORNER CLOSEST TO PACKAGE PIN A1
9 CONTACT MUST REMAIN OUTSIDE THE CENTRAL CAVITY THROUGHOUT THE ACTUATION
STROKE.
10 PICK-AND-PLACE TOOLING KEEP-IN ZONE. NO THOUGH HOLES ALLOWED IN THIS ZONE.
11 SOCKET MANUFACTURER NAME SHOWN ON SIDEWALL. OPPOSITE SIDEWALL CAN BE USED
IF NEEDED.
12 ONLY THE LGA CONTACTS/SOLDER BALLS ALONG THE BOUNDARIES OF THE TWO "L"
ARRAYS ARE SHOWN
IN THE DRAWINGS.
13 THE DIMENSION MEASURED FROM THE TOP OF THE ILM KEY-IN FEATURE TO THE TOP OF
THE SOCKET
ALIGNMENT FEATURE.
14 DO NOT TOOL THIS KEY-IN FEATURE. MOLD TOOLING SHALL ALLOW THIS FEATURE TO
BE ADDED IN THE
FUTURE NO LARGER THAN THE AREA SPECIFIED.
15 SOCKET SEAT PLANES.
REVISION HISTORY
ZONE
REV
DESCRIPTION
DATE
APPROVED
-
1
PRELIMINARY RELEASE
10/23/07
-
E27147
1
4
DWG. NO
SHT.
REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
-
TITLE
SOCKET LGA1156
SIZE
DRAWING NUMBER
REV
A1
E27147
4
SCALE:
4
DO NOT SCALE DRAWING
SHEET
1
OF
4
SEE NOTES
SEE NOTES
FINISH
MATERIAL
-
-
DATE
APPROVED BY
-
-
-
-
DATE
CHECKED BY
02/28/07
B. KNAPIK
DATE
DRAWN BY
02/28/07
L. YUPENG
DATE
DESIGNED BY
THIRD ANGLE PROJECTION
6
7
11
12
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
