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4
Thermal/Mechanical Specifications and Design Guidelines
9.3
Material and Recycling Requirements....................................................................67
10
Boxed Processor Specifications
................................................................................69
10.1 Introduction ......................................................................................................69
10.2 Mechanical Specifications....................................................................................70
10.3 Electrical Requirements ......................................................................................72
10.4 Thermal Specifications........................................................................................73
A
Component Suppliers
...............................................................................................77
B
Mechanical Drawings
...............................................................................................79
C
Socket Mechanical Drawings
....................................................................................97
D
Package Mechanical Drawings
............................................................................... 103
Figures
2-1
Processor Package Assembly Sketch .......................................................................11
2-2
Package View ......................................................................................................12
2-3
Processor Top-Side Markings .................................................................................14
2-4
Processor Package Lands Coordinates .....................................................................15
3-1
LGA1156 Socket with Pick and Place Cover ..............................................................17
3-2
LGA1156 Socket Contact Numbering (Top View of Socket).........................................18
3-3
LGA1156 Socket Land Pattern (Top View of Board) ...................................................19
3-4
LGA1156 Socket NCTF Solder Joints .......................................................................20
3-5
Attachment to Motherboard ...................................................................................21
3-6
Pick and Place Cover.............................................................................................23
3-7
Package Installation / Removal Features .................................................................24
4-1
ILM Cover Assembly .............................................................................................28
4-2
Back Plate ...........................................................................................................28
4-3
Shoulder Screw....................................................................................................29
4-4
ILM Assembly ......................................................................................................30
4-5
Pin 1 and ILM Lever..............................................................................................31
5-1
Flow Chart of Knowledge-Based Reliability Evaluation Methodology .............................36
6-1
Thermal Test Vehicle Thermal Profile for Intel
®
Xeon
®
Processor 3400 Series (95W) .....39
6-2
Thermal Test Vehicle Thermal Profile for Intel
®
Xeon
®
Processor 3400 Series (45W) .....41
6-3
TTV Case Temperature (TCASE) Measurement Location.............................................44
6-4
Frequency and Voltage Ordering ............................................................................46
6-5
Temperature Sensor Data Format...........................................................................49
7-1
Comparison of Case Temperature versus Sensor Based Specification...........................52
7-2
Intel
®
Xeon
®
Processor 3400 Series (95W) Thermal Profile........................................53
7-3
Required YCA for Various TAMBIENT Conditions........................................................55
8-1
1U Heatsink Performance Curves............................................................................60
8-2
1U Heatsink Performance Curves............................................................................61
8-3
1U Collaboration Heatsink Assembly .......................................................................63
8-4
KOZ 3-D Model (Top) in 1U Server .........................................................................64
10-1
Boxed Processor Fan Heatsink................................................................................69
10-2
Space Requirements for the Boxed Processor (side view)...........................................70
10-3
Space Requirements for the Boxed Processor (top view)............................................71
10-4
Space Requirements for the Boxed Processor (overall view) .......................................71
10-5
Boxed Processor Fan Heatsink Power Cable Connector Description ..............................72
10-6
Baseboard Power Header Placement Relative to Processor Socket ...............................73
10-7
Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) ...................74
10-8
Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) ..................74
10-9
Boxed Processor Fan Heatsink Set Points.................................................................75
B-1
Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top).................................80
B-2
Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom)........................81
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...