59
1U Collaboration Thermal Solution
8
1U Collaboration Thermal
Solution
Note:
The collaboration thermal mechanical solution information shown in this document
represents the current state of the data and may be subject to modification.The
information represents design targets, not commitments by Intel.
This section describes the overall requirements for enabled thermal solutions designed
to cool the Intel
®
Xeon
®
processor 3400 series including critical to function
dimensions, operating environment and validation criteria in 1U server system.
8.1
Performance Targets
provides boundary conditions and performance targets for a 1U heatsink to
cool Intel
®
Xeon
®
processor 3400 series in 1U server. These values are used to provide
guidance for heatsink design.
Notes:
1.
The values in
are from final design review.
2.
Max target (mean + 3 sigma) for thermal characterization parameter.
3.
Airflow through the heatsink fins with zero bypass.
4.
Max target for pressure drop (dP) measured in inches H
2
O.
For 1U collaboration heatsink, see
specifies
Ψ
CA
and pressure drop targets at 15.0 CFM.
shows
Ψ
CA
and pressure drop for
the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent
errors associated with reading the graph.
Table 8-1.
Boundary Conditions and Performance Targets
Processor
Altitude
Thermal
Design
Power
T
LA
TTV Target
Ψ
ca
2
Air Flow
3
Pressure
Drop
4
Intel
®
Xeon
®
Processor 3400
Series(95W)
Sea Level
95W
40°C
0.34W/°C
15CFM
0.383
Intel
®
Xeon
®
Processor 3400
Series(45W)
Sea Level
45W
40°C
0.40W/°C
15CFM
0.383
Summary of Contents for BX80605X3440 - Quad Core Xeon X3440
Page 10: ...Introduction 12 Thermal Mechanical Specifications and Design Guidelines...
Page 26: ...LGA1156 Socket 28 Thermal Mechanical Specifications and Design Guidelines...
Page 78: ...Component Suppliers 78...
Page 80: ...Mechanical Drawings 80 Figure B 1 Socket Heatsink ILM Keepout Zone Primary Side for 1U Top...
Page 87: ...87 Mechanical Drawings Figure B 8 Heatsink Compression Spring...
Page 88: ...Mechanical Drawings 88 Figure B 9 Heatsink Load Cup...
Page 89: ...89 Mechanical Drawings Figure B 10 Heatsink Retaining Ring...
Page 91: ...91 Mechanical Drawings Figure B 12 Heatsink Backplate...
Page 92: ...Mechanical Drawings 92 Figure B 13 Heatsink Backplate Insulator...
Page 102: ...Socket Mechanical Drawings 104 Thermal Mechanical Specifications and Design Guidelines...
Page 106: ...Package Mechanical Drawings 108 Thermal Mechanical Specifications and Design Guidelines...
