Intel BX80605X3440 - Quad Core Xeon X3440, Reference

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Thermal/Mechanical Specifications and Design Guidelines 35
LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications
5
LGA1156 Socket and ILM
Electrical, Mechanical, and
Environmental Specifications
This chapter describes the electrical, mechanical, and environmental specifications for
the LGA1156 socket and the Independent Loading Mechanism.
5.1 Component Mass
5.2 Package/Socket Stackup Height
Table 5-2 provides the stackup height of a processor in the 1156-land LGA package and
LGA1156 socket with the ILM closed and the processor fully seated in the socket.
Notes:
1. This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in Appendix C , (b) the height of the package, from the
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor datasheet.
2. The integrated stackup height value is a RSS calculation based on current and planned processors that will
use the ILM design.
5.3 Socket Maximum Temperature
The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. The key temperature limit for the LGA1156 socket is:
• Socket contact interface with package < 100 °C.
Table 5-1. Socket Component Mass
Component Mass
Socket Body, Contacts and PnP Cover 10 g
ILM Cover 29 g
ILM Back Plate 38 g
Table 5-2. 1156-land Package and LGA1156 Socket Stackup Height
Component Stackup Height Note
Integrated Stackup Height (mm)
From Top of Board to Top of IHS
7.781 ± 0.335 mm 2
Socket Nominal Seating Plane Height 3.4 ± 0.2 mm 1
Package Nominal Thickness (lands to top of IHS) 4.381 ± 0.269 mm 1