IBM eServer xSeries 235 Type 8671, Maintenance & Troubleshooting

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Chapter 5. Service replaceable units
This chapter describes the removal of server components.
Important: The field replaceable unit (FRU) procedures are intended for trained
servicers who are familiar with IBM xSeries products. See the parts
listing in “System” on page 156 to determine if the component being
replaced is a customer replaceable unit (CRU) or a FRU.
Thermal grease
This section contains information about removing and replacing the thermal grease
between the heat sink and the microprocessor. The thermal grease must be
replaced anytime the heat sink has been removed from the top of the
microprocessor and is going to be reused, or when debris is found in the grease.
Note:
v Read “Installation guidelines” on page 41.
v
Read the safety notices at “Safety information” on page 163.
v Read “Handling electrostatic discharge-sensitive devices” on page 166.
Complete the following steps to replace damaged or contaminated thermal grease
on the microprocessor and heat sink:
1. Place the heat sink on a clean work surface.
2. Remove the cleaning pad from its package and unfold it completely.
3. Use the cleaning pad to wipe the thermal grease from the bottom of the heat
sink.
Note: Be sure that all of the thermal grease is removed.
4. Use a clean area of the cleaning pad to wipe the thermal grease from the
microprocessor; then, dispose of the cleaning pad after all of the thermal grease
is removed.
Microprocessor
0.01 ML of
thermal grease
5. Use the thermal grease syringe to place 16 uniformly spaced dots of 0.01ML
each on the top of the microprocessor.
© Copyright IBM Corp. 2002
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