41978 AMD RS690M Databook 3.06
© 2008 Advanced Micro Devices, Inc.
5-10
Proprietary
Package Information
•
An oven with 10 heating zones or above is recommended.
•
To ensure that the reflow profile meets the target specification on both sides of the board, a different profile and oven
recipe for the first and second reflow may be required.
•
Mechanical stiffening can be used to minimize board warpage during reflow.
•
It is suggested to decrease temperature cooling rate to minimize board warpage.
•
This reflow profile applies only to RoHS/lead-free (high temperature) soldering process and it should not be used for
Eutectic solder packages. Damage may result if this condition is violated.
•
Maximum 3 reflows are allowed on the same part.
Figure 5-6 RoHS/Lead-Free Solder (SAC305/405 Tin-Silver-Copper) Reflow Profile
Table 5-11 Recommended Board Solder Reflow Profile - RoHS/Lead-Free Solder
Profiling Stage
Temperature
Process Range
Overall Preheat
Room temp to 220
°
C
2 mins to 4 mins
Soaking Time
130
°
C to 170
°
C
Typical 60 – 80 seconds
Liquidus 220
°
C
Typical 60 – 80 seconds
Ramp Rate
Ramp up and Cooling
<2
°
C / second
Peak Max.
245
°
C 235
°
C +/-5
°
C
Temperature at peak
within 5
°
C
240
°
C to 245
°
C
10 – 30 seconds
50
250
150
200
100
Peak 245
°
C max
.
220
°
C
Heating Time
Solder/Part Surface Temperature ( C)
170
°
C
50
250
150
200
100
C max
.
220 C
o
120 - 240 sec max
Heating Time
°
C
60 – 120 sec max
130 C
60 – 80 sec typical
45 – 90 sec max
60 – 80 sec typical
Pre–heating Zone
Soldering Zone
Ramp Rate < 2 C / sec
°
Ramp Rate < 2 C / sec
Soaking Zone
°