Oracle Sun Server X4-4, Руководство по обслуживанию

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Server Subsystems Overview
Sun Server X4-4 Overview 29
Cooling the Two-CPU Configuration
A two-CPU server configuration has fewer components than a fully loaded, four-CPU
configuration. To maximize cooling in a two-CPU configuration, an air baffle is installed
in the memory riser area. The air baffle directs the fan output across the four memory riser
cards and the two CPUs. For more information about the processor subsystem, see “Processor
Subsystem” on page 23 .
Over-Temperature Issues
When the server cooling system is compromised by a hardware component failure or a
airflow blockage, the internal temperature of the server can increase. This temperature
increase can cause component failure. To protect against over-temperature conditions, the
server temperature and components are monitored using sensors. If the reading from a sensor
indicates a temperature outside of the normal operating range of the component, or if a cooling
subsystem-related component (such as a fan module) fails, the server management software
lights the server fault indicator LED for the component and logs an event in the system event
log (SEL). When a fault event occurs, address the issue
immediately
.
For information about troubleshooting the server cooling subsystem, see “Troubleshooting
System Cooling Issues” on page 49 .
Power Subsystem
This section contains information about the server power subsystem.
The server is equipped with two 1030/2060 watt auto-ranging hot-swappable power supplies
that support a two-CPU configuration at 110–127 VAC, or two or four CPU configuration at
200–240 VAC. The dual power supply configuration provides N+N redundancy.
For information about the processor subsystem, see “Processor Subsystem” on page 23 .
Input/Output (I/O) Subsystem
The server I/O storage subsystem consists of the following:
■
“11 PCIe Gen 3 Slots” on page 30
■
“Six 2.5-inch Drive Bays” on page 30
■
“ SATA DVD +/-RW Drive” on page 30