Chapter 4
Working with Parts
©
National Instruments Corporation
4-37
If you chose
SMT
in step 1 of the wizard, the
Package Type
choices
shown below appear:
•
SOT (Small Outline Transistor)
•
TO (Transistor Outline)
•
SO-Gullwing (Small Outline, SOIC, SOP, TSSOP)
•
SO-J (Small Outline J Lead)
•
PLCC (Plastic Leaded Chip Carrier Package)
•
QFP (Quad Flat Package)
•
BGA (Ball Grid Array Package)
•
SBGA (Staggered Ball Grid Array Package)
•
SIP (Single in Line Package)
•
ZIP (Zigzag in Line Package)
4.
Choose the desired
Package Type
and click
Next
to display step 3 of
the wizard.
The following
Package Dimension
choices appear:
•
Units
—Select the unit of measure from the drop-down list.
•
X
—The “x” dimension of the part (displayed on the preview).
•
Y
—The “y” dimension of the part (displayed on the preview).
•
3D Height
—The height of the the part, as displayed in the 3D
view.
•
3D Offset
—The distance between the PCB and the bottom of the
part.
•
Corner Cutoff - Notch (A)
—The size of the notch on the part.
•
Corner Cutoff - Left Top
—Places the notch on the left top of the
part.
•
Corner Cutoff - Right Top
—Places the notch on the right top of
the part.
•
Corner Cutoff - Left Bottom
—Places the notch on the left
bottom of the part.
•
Corner Cutoff - Right Bottom
—Places the notch on the right
bottom of the part.
•
Circle Pin 1 Indicator
—Enable to show a circle around pin 1 of
the part.