Step 6.
Remove the microprocessor.
a.
Open the microprocessor retention latch by gently pressing down the handle a little bit and
then pushing the handle outward.
b.
Open the microprocessor bracket. Keep the bracket in the open position.
c.
Hold the microprocessor by its edges and carefully lift the microprocessor straight up and out
of the socket.
Attention:
Handle the microprocessor carefully. Dropping the microprocessor during removal can
damage the contacts. In addition, contaminants on the microprocessor contacts, such as oil from
your skin, can cause connection failures between the contacts and the socket.
Figure 85. Microprocessor removal
Step 7.
Place the microprocessor on a static-protective surface.
Attention:
The pins on the sockets are fragile. Any damage to the pins might require replacing the
system board.
Installing the microprocessor and heat sink (Trained technician only)
The following notes describe the type of microprocessor that the server supports and other information that
you must consider when you install a microprocessor and heat sink:
• The server supports one Intel land grid array (LGA) 1151 dual-core or quad-core microprocessor. The
type, speed, and L3 cache of the microprocessor depends on the server model.
• Read the documentation that comes with the microprocessor to determine whether you have
to update the server firmware. To download the most current level of server firmware, go to
http://www.lenovo.com/support and http://www.ibm.com/support/fixcentral.
• The microprocessor uses an integrated voltage regulator on the system board.
• The microprocessor speeds are automatically set for this server; therefore, you do not have to set any
microprocessor frequency-selection jumpers or switches.
• If the thermal-grease protective cover (for example, a plastic cap or tape liner) is removed from the heat
sink, do not touch the thermal grease on the bottom of the heat sink or set down the heat sink. For more
information about applying or working with thermal grease, see “Thermal grease” on page 150.
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