HPE Persistent Memory module
Enhanced processor performance does not support the HPE Persistent Memory module.
Chassis
Fan configuration
Number of drives
supported by the server
Maximum inlet ambient
temperature
Apollo r2200
Gen10 Chassis
(12 LFF
backplane)
Redundant and
nonredundant
5 to 6 drives
Not supported
5 to 6 drives
Not supported
0 to 4 drives
22°C (71.6°F)
Apollo r2600
Gen10 Chassis
(24 SFF or 16
SFF + 8 NVMe
backplane)
Redundant and
nonredundant
0 to 10 drives
22°C (71.6°F)
Apollo r2800
Gen10 Chassis
(24 SFF
backplane with
SAS expander)
Redundant and
nonredundant
0 to 24 drives
22°C (71.6°F)
Apollo r2800
Gen10 Chassis
(16 NVMe
backplane)
Redundant and
nonredundant
0 to 8 drives
25°C (77°F)
The drive capacity must be less than 10 TB.
The drive capacity must be greater than or equal to 10 TB.
If the component is installed in server 1, and the server is installed in the Apollo r2200 Gen10 Chassis, drive blanks
must be installed in drive bays 1-2 and 1-10. Similarly, if the component is installed in server 3, and the server is
installed in the Apollo r2200 Gen10 Chassis, drive blanks must be installed in drive bays 3-2 and 3-10. For more
information, see
Installing drive blanks and thermal bezel blanks for components with thermal limitations
on
page 23.
HPE Smart Array controllers
CAUTION:
To prevent improper cooling and thermal damage, do not keep an energy pack inside
the chassis when the Smart Array P-class controller is not installed.
Description
Chassis
Fan
configuration
Number of drives
supported by the server
Maximum inlet
ambient
temperature
P824i-p
controller
Apollo r2200
Gen10 Chassis
(12 LFF
backplane)
Redundant and
nonredundant
35°C (95°F)
35°C (95°F)
Table Continued
160
Specifications
